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      Android Mainboard
      US$49.90-59.90 / Piece
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      What is The Rk3568 Embedded Industry Motherboard Customize Android Mainboard for Use in Dual-Screen POS Scales

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      5 Pieces US$49.90-59.90 / Piece

      Sepcifications

      • CPU Socket BGA
      • Form Factor 170mm*105mm
      • Operating Temperature -20℃ to 70℃
      • Power Supply Type ATX12V
      • Storage Interface Emmc
      • Supported Memory Type 2/4/8GB Lpddr4 + 128GB Emmc
      • System Expansion Slot Pcie 3.0
      • Transport Package Inner-Bubble Cotton; Outer-Carton
      • Specification Customized
      • Trademark Zhenda
      • Origin Shenzhen, China
      • Main Chipset Rockchip
      • Printed Circuit Board Six Layer
      • Certificates UL94V-0+RoHS
      • Customization Available
      • Integrated Graphics Integrated Graphics
      • Item Control Board PCBA
      • Audio Effects HiFi
      • Production Type SMT & DIP & Assembling & Testing
      • Advantages PCB Design/Assembly, PCBA & EMS
      • Inspection 100% IQC, Ipqc, Fqc, QA, Ict
      • Services OEM&ODM Manufacturer Since 2005

      Product Description

      Product Description The RK3568 Embedded Industry Motherboard Customize Android mainboard for use in dual-screen POS scales Model No. UPX-3568 CPU RK3568 Cortex-A55 Quad-core, up to 2.0GHz GPU ARM Mali-G52 2EE, supports OpenGL ES 1.1/2.0/3.2, OpenCL 2.0, Vulkan 1.1; Embedded ...

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      Android Mainboard Comparison
      Transaction Info
      Price US$49.90-59.90 / Piece US$332.00 / Piece US$332.00 / Piece US$365.00 / Piece US$64.00-89.00 / Piece
      Min Order 5 Pieces 1 Piece 1 Piece 1 Piece 1 Piece
      Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union
      Quality Control
      Product Certification - CE/FCC Compliant CE/FCC Compliant CE/FCC Compliant -
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia, South Asia North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia, South Asia North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia, South Asia Domestic
      Annual Export Revenue - - - - -
      Business Model - ODM, OEM ODM, OEM ODM, OEM Own Brand, ODM, OEM
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Product Attributes
      Specification
      CPU Socket: BGA;
      Form Factor: 170mm*105mm;
      Operating Temperature: -20℃ to 70℃;
      Power Supply Type: ATX12V;
      Storage Interface: Emmc;
      Supported Memory Type: 2/4/8GB Lpddr4 + 128GB Emmc;
      System Expansion Slot: Pcie 3.0;
      Main Chipset: Rockchip;
      Printed Circuit Board: Six Layer;
      Certificates: UL94V-0+RoHS;
      Customization: Available;
      Integrated Graphics: Integrated Graphics;
      Item: Control Board PCBA;
      Audio Effects: HiFi;
      Production Type: SMT & DIP & Assembling & Testing;
      Advantages: PCB Design/Assembly, PCBA & EMS;
      Inspection: 100% IQC, Ipqc, Fqc, QA, Ict;
      Services: OEM&ODM Manufacturer Since 2005;
      CPU Socket: LGA1151;
      Form Factor: ATX;
      Operating Temperature: -20°c ~ 60°c;
      Power Supply Type: ATX/at;
      Storage Interface: M.2;
      Supported Memory Type: DDR4;
      System Expansion Slot: PCIe x16;
      Weight: Gw:1200g / Nw:700g;
      Digital I/O: 1 X 12bit-Dio;
      Memory: up to 64GB;
      Chipset: Intel® Q470/Q470e;
      CPU Socket: LGA1151;
      Form Factor: ATX;
      Operating Temperature: -20°c ~ 60°c;
      Power Supply Type: ATX/at;
      Storage Interface: M.2;
      Supported Memory Type: DDR4;
      System Expansion Slot: PCIe x16;
      Weight: Gw:1200g / Nw:700g;
      Digital I/O: 1 X 12bit-Dio;
      Memory: up to 64GB;
      Chipset: Intel® Q470/Q470e;
      CPU Socket: LGA 1200;
      Form Factor: ATX;
      Operating Temperature: 0℃ to 60℃;
      Power Supply Type: ATX;
      Storage Interface: M.2;
      Supported Memory Type: DDR4;
      System Expansion Slot: PCIe x16;
      Weight: Gw:1200g / Nw:700g;
      Digital I/O: 1 X 12bit-Dio;
      Memory: up to 128GB;
      Chipset: Intel® Q470/Q470e;
      CPU Socket: Fcbga1264 Socket;
      Form Factor: Nano-Itx, 120X120X27mm(Lxwxh);
      Operating Temperature: -20℃ to 70℃;
      Power Supply Type: Wide Voltage DC 12V~24V;
      Storage Interface: M.2 2280 Nvme;
      Supported Memory Type: DDR4;
      System Expansion Slot: M.2_WiFi Key-E Pcie3.0 2230 Socket;
      Supplier Name

      Shenzhen Zhendatech Co., Ltd.

      Gold Member Audited Supplier

      Ailean Technologies Corp.

      Gold Member Audited Supplier

      Ailean Technologies Corp.

      Gold Member Audited Supplier

      Ailean Technologies Corp.

      Gold Member Audited Supplier

      Shenzhen Elsky Technology Co., Ltd.

      Diamond Member Audited Supplier