| Specification |
Type: Rigid Circuit Board;
Dielectric: Aluminum;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: UC;
Surface Finihsing: Immersion Gold;
Board Layer: 2 Layers;
Lead Time: 6 Working Days;
MOQ: 1 PCS;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Mustar;
Copper Thickness: 1-12 Oz;
Board Thickness: 0.8, 1.0, 1.2, 1.6, 2, 2.4mm;
Surface Finishing: HASL,Immersion Gold,Flash Gold, Plated Silver, OSP;
Minimum Line Width Spacing: 0.015mm;
Minimum Line Spacing: 0.015mm;
Testing Service: Ict, Function Test, X-ray, Aoi;
MOQ: 1 PCS;
Layers: 1-64;
Warranty: 2 Years;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Abis;
Test: Flying Probe and Fixture;
Solder Mask: Green;
Board Thickness: 1.6mm / 2.0mm / Custom;
Custom: OEM / ODM;
Copper: 1oz / 35um, 2oz / 70um;
Surface Finish: HASL / Enig;
Layers: 4 Layers, 8 Layers;
Legend: White;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Customized;
Service: PCB+Assembly+Components;
Testing Service: Electrical Testing, Flying Probe Tester, Functiona;
Value-Added Services: Bom Analysis, Conformal Coating, IC Programming;
Technical Support: Free Dfm/a Check, Bom Analysis;
Product Name: Industrial Equipment PCBA;
Placement Precision: ±0.03mm / ±0.01mm (Chip);
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Abis;
Test: Flying Probe and Fixture;
Solder Mask: Blue / Green;
Board Thickness: 1.6mm / 2.0mm / Custom;
Custom: OEM / ODM;
Copper: 1oz / 35um, 2oz / 70um;
Surface Finish: HASL / Enig;
Layers: 6 Layers;
Legend: White;
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