| Specification |
Mode of Production: SMT & Thd;
Layers: 1-32 Layers;
Customized: Customized;
Condition: New;
Controlled Impedance: 4/6/8/10/12/14/16/18/20/.../32 Layers;
Impedance Tolerance: ±10%;
Material: Fr-4 / Aluminum-Core /Copper-Core /RF PCB;
Fr-4 Dielectric Constants: 4.5 (2-Layer PCB);
Dimension Tolerance: ±0.1mm;
Thickness: 0.4-4.5 mm;
Thickness Tolerance: ± 10% (Thickness≥1.0mm);
Finished Inner Layer Copper: 0.5 Oz / 1 Oz / 2 Oz;
Soldermask: Green, Purple, Red, Yellow, Blue, White, and Black;
Surface Finish: HASL (Leaded / Lead-Free), Enig, OSP;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
PCBA-Testing: X-ray, Aoi;
Type: Rigid Circuit Board;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
|
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
PCBA-Testing: X-ray, Aoi;
Type: Rigid Circuit Board;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
|
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
PCBA-Testing: X-ray, Aoi;
Type: Rigid Circuit Board;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
|
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
PCBA-Testing: X-ray, Aoi;
Type: Rigid Circuit Board;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
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