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      Low Power PCB Assembly
      US$0.60-1.00 / Piece
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      What is Low Power Consumption 4-Layer Rigid Low Power PCB Assembly for Desktop Computers

      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      5-499 Pieces US$1.00

      500-999 Pieces US$0.80

      1,000-9,999 Pieces US$0.70

      10,000+ Pieces US$0.60

      Sepcifications

      • Mode of Production SMT & Thd
      • Layers 1-32 Layers
      • Certification RoHS, ISO
      • Customized Customized
      • Condition New
      • Transport Package Anti-Static Bubble Wrap ESD-Safe Blister Tray
      • Specification 41*40.5*30.5
      • Trademark Tdt-Ele
      • Origin Guangdong, China
      • Controlled Impedance 4/6/8/10/12/14/16/18/20/.../32 Layers
      • Impedance Tolerance ±10%
      • Material Fr-4 / Aluminum-Core /Copper-Core /RF PCB
      • Fr-4 Dielectric Constants 4.5 (2-Layer PCB)
      • Dimension Tolerance ±0.1mm
      • Thickness 0.4-4.5 mm
      • Thickness Tolerance ± 10% (Thickness≥1.0mm)
      • Finished Inner Layer Copper 0.5 Oz / 1 Oz / 2 Oz
      • Soldermask Green, Purple, Red, Yellow, Blue, White, and Black
      • Surface Finish HASL (Leaded / Lead-Free), Enig, OSP

      Product Description

      Product Description PREMIUM RIGID PCB ASSEMBLY SERVICES | HIGH-QUALITY PCBA MANUFACTURING Looking for reliable rigid PCB assembly solutions? Our professional PCBA manufacturing services deliver exceptional quality from prototype to high-volume production. We specialize in multilayer PCB assembly ...

      Learn More

      Low Power PCB Assembly Comparison
      Transaction Info
      Price US$0.60-1.00 / Piece US$0.50-2.00 / Piece US$0.50-2.00 / Piece US$0.50-2.00 / Piece US$0.50-2.00 / Piece
      Min Order 5 Pieces 1 Piece 1 Piece 1 Piece 1 Piece
      Payment Terms T/T T/T, PayPal, Western Union, Small-amount payment T/T, PayPal, Western Union, Small-amount payment T/T, PayPal, Western Union, Small-amount payment T/T, PayPal, Western Union, Small-amount payment
      Quality Control
      Product Certification RoHS, ISO RoHS, ISO RoHS, ISO RoHS, ISO RoHS, ISO
      Management System Certification ISO9001:2015, ISO45001:2018, Others - - - -
      Trade Capacity
      Export Markets Europe, Domestic South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe
      Annual Export Revenue - - - - -
      Business Model ODM, OEM - - - -
      Average Lead Time Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Mode of Production: SMT & Thd;
      Layers: 1-32 Layers;
      Customized: Customized;
      Condition: New;
      Controlled Impedance: 4/6/8/10/12/14/16/18/20/.../32 Layers;
      Impedance Tolerance: ±10%;
      Material: Fr-4 / Aluminum-Core /Copper-Core /RF PCB;
      Fr-4 Dielectric Constants: 4.5 (2-Layer PCB);
      Dimension Tolerance: ±0.1mm;
      Thickness: 0.4-4.5 mm;
      Thickness Tolerance: ± 10% (Thickness≥1.0mm);
      Finished Inner Layer Copper: 0.5 Oz / 1 Oz / 2 Oz;
      Soldermask: Green, Purple, Red, Yellow, Blue, White, and Black;
      Surface Finish: HASL (Leaded / Lead-Free), Enig, OSP;
      Metal Coating: Copper;
      Mode of Production: DIP;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      Type: Rigid Circuit Board;
      Dielectric: Fr-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Insulation Materials: Epoxy Resin;
      Processing Technology: Immersion Gold;
      Copper Thickness: 3oz -105oz;
      Surface Finish: Gold Finger;
      Special Technology: Metal Edging;
      Special 1: Blind Hole;
      Special 2: Buried Vias;
      Special 3: Flex-Rigid PCB;
      Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
      Metal Coating: Copper;
      Mode of Production: DIP;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      Type: Rigid Circuit Board;
      Dielectric: Fr-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Insulation Materials: Epoxy Resin;
      Processing Technology: Immersion Gold;
      Copper Thickness: 3oz -105oz;
      Surface Finish: Gold Finger;
      Special Technology: Metal Edging;
      Special 1: Blind Hole;
      Special 2: Buried Vias;
      Special 3: Flex-Rigid PCB;
      Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
      Metal Coating: Copper;
      Mode of Production: DIP;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      Type: Rigid Circuit Board;
      Dielectric: Fr-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Insulation Materials: Epoxy Resin;
      Processing Technology: Immersion Gold;
      Copper Thickness: 3oz -105oz;
      Surface Finish: Gold Finger;
      Special Technology: Metal Edging;
      Special 1: Blind Hole;
      Special 2: Buried Vias;
      Special 3: Flex-Rigid PCB;
      Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
      Metal Coating: Copper;
      Mode of Production: DIP;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      Type: Rigid Circuit Board;
      Dielectric: Fr-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Insulation Materials: Epoxy Resin;
      Processing Technology: Immersion Gold;
      Copper Thickness: 3oz -105oz;
      Surface Finish: Gold Finger;
      Special Technology: Metal Edging;
      Special 1: Blind Hole;
      Special 2: Buried Vias;
      Special 3: Flex-Rigid PCB;
      Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
      Supplier Name

      Shenzhen Tianditong Electronics Co., Ltd

      Diamond Member Audited Supplier

      Shenzhen Hemeixin Electronic Co., Limited

      Gold Member Audited Supplier

      Shenzhen Hemeixin Electronic Co., Limited

      Gold Member Audited Supplier

      Shenzhen Hemeixin Electronic Co., Limited

      Gold Member Audited Supplier

      Shenzhen Hemeixin Electronic Co., Limited

      Gold Member Audited Supplier