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      Power Module Assembly
      US$0.60-1.00 / Piece
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      What is PCBA Factory High Copper Circuit Board and PCBA Power Module Assembly

      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      5-499 Pieces US$1.00

      500-999 Pieces US$0.80

      1,000-9,999 Pieces US$0.70

      10,000+ Pieces US$0.60

      Sepcifications

      • Metal Coating Gold
      • Mode of Production SMT/ Thru-Hole
      • Layers 1 - 32 Layers
      • Base Material FR-4
      • Certification ISO, IATF16949/QC08000/Apple Mfi
      • Customized Customized
      • Condition New
      • Transport Package Anti-Static Bubble Wrap ESD-Safe Blister Tray
      • Specification 41*40.5*30.5
      • Trademark TDT-ELE
      • Origin Guangdong, China
      • PCB Thickness No Limit
      • PCBA Order Volume No Limit
      • Layer Stackup All Stack-up
      • Edge Rails Necessary
      • Fiducials Necessary
      • Minimum Package 1005
      • Minimum IC Pin Spacing 0.3mm
      • Minimum BGA Spacing 0.3mm
      • Mounting Machine Nxt-M6III
      • Spi Yes
      • Aoi Yes
      • Visual Inspection Yes
      • Function Test Yes
      • Conformal Coating Yes
      • PCBA Potting Yes

      Product Description

      Product Description TURNKEY PCBA SERVICES | ONE-STOP PCB ASSEMBLY &FULL BOX-BUILD SOLUTIONS Looking for a reliable turnkey PCBA manufacturer that handles everything from design to delivery? Our end-to-end Turnkey PCB Assembly service eliminates supply chain complexity by integrating PCB ...

      Learn More

      Power Module Assembly Comparison
      Transaction Info
      Price US$0.60-1.00 / Piece US$0.30-1.00 / Piece US$0.30-2.00 / Piece US$0.30-2.00 / Piece US$0.30-2.00 / Piece
      Min Order 5 Pieces 1 Piece 1 Piece 1 Piece 1 Piece
      Payment Terms T/T T/T, PayPal, Western Union, Small-amount payment T/T, PayPal, Western Union, Small-amount payment T/T, PayPal, Western Union, Small-amount payment T/T, PayPal, Western Union, Small-amount payment
      Quality Control
      Product Certification ISO, IATF16949/QC08000/Apple Mfi RoHS, ISO RoHS, ISO RoHS, ISO RoHS, ISO
      Management System Certification ISO9001:2015, ISO45001:2018, Others - - - -
      Trade Capacity
      Export Markets Europe, Domestic South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe
      Annual Export Revenue - - - - -
      Business Model ODM, OEM - - - -
      Average Lead Time Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Metal Coating: Gold;
      Mode of Production: SMT/ Thru-Hole;
      Layers: 1 - 32 Layers;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      PCB Thickness: No Limit;
      PCBA Order Volume: No Limit;
      Layer Stackup: All Stack-up;
      Edge Rails: Necessary;
      Fiducials: Necessary;
      Minimum Package: 1005;
      Minimum IC Pin Spacing: 0.3mm;
      Minimum BGA Spacing: 0.3mm;
      Mounting Machine: Nxt-M6III;
      Spi: Yes;
      Aoi: Yes;
      Visual Inspection: Yes;
      Function Test: Yes;
      Conformal Coating: Yes;
      PCBA Potting: Yes;
      Metal Coating: Copper;
      Mode of Production: DIP;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      Type: Rigid Circuit Board;
      Dielectric: Fr-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Insulation Materials: Epoxy Resin;
      Processing Technology: Immersion Gold;
      Copper Thickness: 3oz -105oz;
      Surface Finish: Gold Finger;
      Special Technology: Metal Edging;
      Special 1: Blind Hole;
      Special 2: Buried Vias;
      Special 3: Flex-Rigid PCB;
      Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
      Metal Coating: Copper;
      Mode of Production: DIP;
      Layers: Double-Layer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      Type: Rigid Circuit Board;
      Dielectric: Fr-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Insulation Materials: Epoxy Resin;
      Processing Technology: Immersion Gold;
      Copper Thickness: 3oz -105oz;
      Surface Finish: Gold Finger;
      Special Technology: Metal Edging;
      Special 1: Blind Hole;
      Special 2: Buried Vias;
      Special 3: Flex-Rigid PCB;
      Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
      Metal Coating: Copper;
      Mode of Production: DIP;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      Type: Rigid Circuit Board;
      Dielectric: Fr-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Insulation Materials: Epoxy Resin;
      Processing Technology: Immersion Gold;
      Copper Thickness: 3oz -105oz;
      Surface Finish: Gold Finger;
      Special Technology: Metal Edging;
      Special 1: Blind Hole;
      Special 2: Buried Vias;
      Special 3: Flex-Rigid PCB;
      Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
      Metal Coating: Copper;
      Mode of Production: DIP;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      Type: Rigid Circuit Board;
      Dielectric: Fr-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Insulation Materials: Epoxy Resin;
      Processing Technology: Immersion Gold;
      Copper Thickness: 3oz -105oz;
      Surface Finish: Gold Finger;
      Special Technology: Metal Edging;
      Special 1: Blind Hole;
      Special 2: Buried Vias;
      Special 3: Flex-Rigid PCB;
      Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
      Supplier Name

      Shenzhen Tianditong Electronics Co., Ltd

      Diamond Member Audited Supplier

      Shenzhen Hemeixin Electronic Co., Limited

      Gold Member Audited Supplier

      Shenzhen Hemeixin Electronic Co., Limited

      Gold Member Audited Supplier

      Shenzhen Hemeixin Electronic Co., Limited

      Gold Member Audited Supplier

      Shenzhen Hemeixin Electronic Co., Limited

      Gold Member Audited Supplier