| Specification |
Mode of Production: SMT;
Customized: Non-Customized;
Condition: New;
Delivery Time: 1-7days;
MOQ: 1unit;
Part No.1: Pilz Pnoz S3;
Part No.2: Vpc-V5.7b 0313-1040W for Kohyoung Spi;
Part No.3: Vpc-V5.7b 0313-1040W for Kohyoung Spi;
Part No4: Kohyoung Ky8030-2&3(Old Version) Dual Spi Io Board;
Part No5: Mirtec Io Board Amc-C04321dp Rev9.0;
|
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Product Name: New Energy PCBA;
Service: PCB+Assembly+Components;
Testing Service: Electrical Testing, Flying Probe Tester, Functiona;
Value-Added Services: Bom Analysis, Conformal Coating, IC Programming;
Technical Support: Free Dfm/a Check, Bom Analysis;
Placement Precision: ±0.03mm / ±0.01mm (Chip);
|
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Testing Service: Electrical Testing, Flying Probe Tester, Functiona;
Service: PCB+Assembly+Components;
Value-Added Services: Bom Analysis, Conformal Coating, IC Programming;
Technical Support: Free Dfm/a Check, Bom Analysis;
Product Name: Consumer Electronics;
Placement Precision: ±0.03mm / ±0.01mm (Chip);
|
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Testing Service: Electrical Testing, Flying Probe Tester, Functiona;
Service: PCB+Assembly+Components;
Value-Added Services: Bom Analysis, Conformal Coating, IC Programming;
Technical Support: Free Dfm/a Check, Bom Analysis;
Product Name: Consumer Electronics;
Placement Precision: ±0.03mm / ±0.01mm (Chip);
|
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Testing Service: Electrical Testing, Flying Probe Tester, Functiona;
Service: PCB+Assembly+Components;
Value-Added Services: Bom Analysis, Conformal Coating, IC Programming;
Technical Support: Free Dfm/a Check, Bom Analysis;
Product Name: Consumer Electronics;
Placement Precision: ±0.03mm / ±0.01mm (Chip);
|