| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Service: PCB+Assembly+Components;
Testing Service: Electrical Testing, Flying Probe Tester, Functiona;
Value-Added Services: Bom Analysis, Conformal Coating, IC Programming;
Technical Support: Free Dfm/a Check, Bom Analysis;
Product Name: Industrial Equipment PCBA;
Placement Precision: ±0.03mm / ±0.01mm (Chip);
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: PCBA Circuit Board;
MOQ: 1 PCS;
Min Hole Size: 0.1mm (4 Mil);
Copper Thickness: 0.5 Oz-3oz (18 Um-385 Um);
Board Thickness: 0.2mm-4mm;
Surface Finish: HASL, Lf HASL, Imm Gold, Imm Silver, OSP etc;
Service: PCB/PCBA/PCB Design and Layout;
Test Service: E-Test, Aoi, X-ray, Function Test;
Product Name: PCB Notebook Laptop Bluetooth Keyboard;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Immersion Gold PCB;
Min Hole Size: 0.1mm (4 Mil);
Copper Thickness: 0.5 Oz-3oz (18 Um-385 Um);
Board Thickness: 0.2mm-4mm;
Surface Finish: HASL, Lf HASL, Imm Gold, Imm Silver, OSP etc;
Service: PCB/PCBA/PCB Design and Layout;
Test Service: E-Test, Aoi, X-ray, Function Test;
Product Name: PCB Notebook Laptop Bluetooth Keyboard;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Immersion Gold PCB;
Min Hole Size: 0.1mm (4 Mil);
Copper Thickness: 0.5 Oz-3oz (18 Um-385 Um);
Board Thickness: 0.2mm-4mm;
Surface Finish: HASL, Lf HASL, Imm Gold, Imm Silver, OSP etc;
Service: PCB/PCBA/PCB Design and Layout;
Test Service: E-Test, Aoi, X-ray, Function Test;
Product Name: PCB Notebook Laptop Bluetooth Keyboard;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Synthetic Fiber;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Brand: Xjypcb;
Guangdong: Shenzhen;
Surface Finishing: Hf-HASL;
Copper Thickness: 35um;
Board Thickness: 1.2mm;
Min. Hole Size: 0.15mm;
Min. Line Wigth: 0.25mm;
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