| Specification |
Metal Coating: Gold;
Mode of Production: SMT, DIP, Manual Welding, etc.;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Application: Electronic Products;
Quality Standard: Ipc 610 Class II;
Board Thickness: 0.4-2.0mm;
Surface Finihsing: OSP, HASL, Lf HASL, Enig, Carbon Oil, Enepig;
Min. SMD Size: 01005;
Solder Mask Color: Green, White, Black, Blue, Yellow, Red, Purple;
Silkscreen Color: Green, White, Black, Blue, Yellow;
Copper Thickness: 0.5-4 Oz;
Layer: 1-20 Layers;
Board Material: Fr4, H-Tg, Cem, Aluminum, Copper Base;
PCB Testing: E-Test, Fly Probe Test, Visual Checking;
PCBA Testing: Aoi, Ict, Fct, Burn-in, Vibration Test;
Transportation: DHL, TNT, UPS, FedEx IP/Ie, EMS, Air/Sea Shipment;
Service: One-Stop Service;
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Metal Coating: Tin;
Mode of Production: DIP;
Layers: Single-Layer;
Base Material: AIN;
Customized: Non-Customized;
Condition: New;
Package: Standard;
Function: Development and Debugging;
Application: Electronic Project for Control;
Features: Mini Development Board;
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Metal Coating: Tin;
Mode of Production: DIP;
Layers: Single-Layer;
Base Material: AIN;
Customized: Non-Customized;
Condition: New;
Package: Standard;
Function: Development and Debugging;
Application: Electronic Project for Control;
Features: Mini Development Board;
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Customized: Customized;
Condition: New;
Solder Mask Color: Green, Blue, Yellow, White, Black, Red;
Special Process: Buried Hole, Blind Hole, Partial High Density, Bac;
Copper Thickness: 1/2oz, 1oz, 2oz, 3oz, 4oz, 5oz-10 Oz;
Layer Count: 1-50 Layers;
Quality Standard: Ipc Class 2 and Ipc Class 3;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Layer: 1-24 Layers;
Material: Fr-4, High Tg, Isola, Aluminum, Rogers, etc;
PCB Type: Rigid, Flexible, Rigid-Flexible;
Surface Finish: HASL, Lf HASL, Imm Gold, Imm Silver, OSP etc;
Solder Mask: Green, Red, White, Yellow, Blue, Black, Orange etc;
Min Linewidth/Linespacing: 0.075mm;
Min Hole Diameter: 0.15mm;
Min Solder Resist Bridge: 0.1mm;
Finished Thickness: 0.2-4mm;
Mounting Component Pitch: 0.15mm;
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