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      Circuit Board
      US$1.00-30.00 / Piece
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      What is Factory OEM/ODM Electronics Components Assembly PCB for Solar Ceiling Fan 45W AC/DC

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      1 Piece US$1.00-30.00 / Piece

      Sepcifications

      • Type Rigid Circuit Board
      • Dielectric FR-4
      • Material Paper Phenolic Copper Foil Substrate
      • Application Consumer Electronics, Communications, Aerospace
      • Flame Retardant Properties V0
      • Mechanical Rigid Rigid
      • Processing Technology Electrolytic Foil
      • Base Material Copper
      • Insulation Materials Organic Resin
      • Brand Customized
      • Transport Package Packed with ESD Protection in Carton
      • Trademark customized
      • Origin Shenzhen, China
      • Basic Material Fr-4
      • PCBA Testing X-ray, Aoi Test, Function Test
      • PCBA Min. BGA Pitch 0.2mm
      • Certificate RoHS, UL / ISO9001, ISO13485, IATF16949
      • Other Service ODM, OEM, Final Product Assembling
      • PCB Surface Treatment HASL Lead Free, OPS, Immersion Tin/Gold, etc

      Product Description

      Our Service Factory OEM/ODM electronics components assembly pcb for Solar Ceiling Fan 45W AC/DC Company Profile Who we are? We have more than 10 years' experience in PCBA contract manufacturing, professionally providing SMT, DIP, MI, AI, PCB assembling, final product assembling, ...

      Learn More

      Circuit Board Comparison
      Transaction Info
      Price US$1.00-30.00 / Piece US$2.00-4.50 / Piece US$1.50-2.80 / Piece US$1.50-3.50 / Piece US$2.40-24.80 / Piece
      Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
      Payment Terms T/T LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram
      Quality Control
      Product Certification RoHS, UL / ISO9001, ISO13485, IATF16949 - - - -
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
      Annual Export Revenue - - - - -
      Business Model - - - - -
      Average Lead Time Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Paper Phenolic Copper Foil Substrate;
      Application: Consumer Electronics, Communications, Aerospace;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Customized;
      Basic Material: Fr-4;
      PCBA Testing: X-ray, Aoi Test, Function Test;
      PCBA Min. BGA Pitch: 0.2mm;
      Other Service: ODM, OEM, Final Product Assembling;
      PCB Surface Treatment: HASL Lead Free, OPS, Immersion Tin/Gold, etc;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Board Thickness: 1.6mm;
      Copper Thickness: 1oz;
      Solder Mask Type: Green;
      Silkscreen: White;
      Certificates: UL, RoHS, SGS, ISO9001;
      Shipping: DHL, UPS, TNT, FedEx, etc;
      Min. Hole Size: 0.25mm;
      Min. Line Width: 0.15mm;
      Min. Line Spacing: 0.15mm;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Board Thickness: 1.6mm;
      Copper Thickness: 1oz;
      Solder Mask Type: Green;
      Silkscreen: White;
      Certificates: UL, RoHS, SGS, ISO9001;
      Shipping: DHL, UPS, TNT, FedEx, etc;
      Min. Hole Size: 0.25mm;
      Min. Line Width: 0.15mm;
      Min. Line Spacing: 0.15mm;
      Surface Treatment: Immersion Gold;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Board Thickness: 1.6mm;
      Copper Thickness: 1oz;
      Solder Mask Type: Green;
      Silkscreen: White;
      Certificates: UL, RoHS, SGS, ISO9001;
      Shipping: DHL, UPS, TNT, FedEx, etc;
      Min. Hole Size: 0.25mm;
      Min. Line Width: 0.15mm;
      Min. Line Spacing: 0.15mm;
      Surface Treatment: Immersion Gold;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Board Thickness: 1.6mm;
      Copper Thickness: 1oz;
      Solder Mask Type: Green;
      Silkscreen: White;
      Certificates: UL, RoHS, SGS, ISO9001;
      Shipping: DHL, UPS, TNT, FedEx, etc;
      Min. Hole Size: 0.25mm;
      Min. Line Width: 0.15mm;
      Min. Line Spacing: 0.15mm;
      Surface Treatment: Immersion Gold;
      Supplier Name

      Shenzhen Grandtop Electronics Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Xinjiaye Electronics Technology Co., Ltd.

      Gold Member Audited Supplier

      Shenzhen Xinjiaye Electronics Technology Co., Ltd.

      Gold Member Audited Supplier

      Shenzhen Xinjiaye Electronics Technology Co., Ltd.

      Gold Member Audited Supplier

      Shenzhen Xinjiaye Electronics Technology Co., Ltd.

      Gold Member Audited Supplier