| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: New Chip;
Capacity: 1000000;
OEM/ODM: Available;
Sample: Available;
Surface Treatment: OSP, Enig, HASL, AG Immersion;
Certificate Gurantee: Yes;
Test: 100%E-Testing;
Min Bonding Pad Diameter: 10mil;
Min Thickness of Soldermask: 10um;
Color of Silk-Screen: White, Yellow, Black;
Data File Format: Gerber File and Drilling File, Protel Series, ...;
Material for PCB: Fr-4, High Tg Fr$, Halogen Free, Rogers, Cem-1, Ari;
Layer Count: 1-20 Layers;
Shipping: DHL/UPS/FedEx/Air/Sea;
|
Type: Rigid Circuit Board;
Dielectric: Taconic Tsm-Ds3;
Material: Ceramic-Filled Woven Fiberglass PTFE Laminates;
Application: High-Performance RF Applications.;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Enig;
Base Material: Taconic Tsm-Ds3 with a Core Thickness of 0.762 mm;
Insulation Materials: Ceramic-Filled Fiberglass.;
Brand: Taconic;
Test: 100% Electrical Test Prior Shipment;
Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc;
Service Area: Worldwide, Globally.;
Board Types: Rigid PCB;
|
Type: Multilayer PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4/Tg/Cem-1/Aluminium;
Insulation Materials: Organic Resin;
Brand: Smart;
Number of Layers: 2/4/6/8/12/14 or Custom;
Board Size: Custom;
PCB Cutting: Shear V-Score, Tab-Routed;
Min Trace/Gap: 0.075mm or 3mil;
Board Thickness: 0.2-4.0mm;
|
Type: Multilayer PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4.Tg.Cem-1,Aluminium;
Insulation Materials: Organic Resin;
Brand: Smart;
Selling Units: Single Item;
Min Drill Hole Diameter: 0.010.1mm or 10 Mil;
Number of Layers: 2/4/6/8/12/Custom;
Copper Thickness: 0.5-6.0oz;
Min. Hole Size: 0.1mm;
Min Trace/Gap: 0.075mm or 3mil;
Silk Scre En Min Line Width: 0.006or0.15mm;
Board Size: Custom;
PCB Cutting: Shear V-Score Tab-Routed;
Board Thickness: 0.2-4.0mm;
|
Type: Rigid Circuit Board;
Dielectric: PTFE (Polytetrafluoroethylene) + Fiberglass Cloth;
Material: PTFE (Polytetrafluoroethylene) + Fiberglass Cloth;
Application: RF Application;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Enig;
Base Material: PTFE (Polytetrafluoroethylene) + Fiberglass Cloth;
Insulation Materials: PTFE (Polytetrafluoroethylene) + Ceramic Filler (N;
Brand: Wangling;
Board Types: Rigid PCB;
Test: 100% Electrical Test Prior Shipment;
Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc;
Service Area: Worldwide, Globally;
|