PCBA Manufacturing

US$0.03-10.00 / Piece

Manufacture Android Motherboard PCBA Assembly pictures & photos

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What is Manufacture Android Motherboard PCBA Assembly

Name: Manufacture Android Motherboard PCBA Assembly
Uploaded: 2026-02-18T16:38:15+08:00
Description: Company Service Specifications Details Material Type FR-4, CEM-1, CEM-3, Aluminium Clad,Arlon*,Teflon,Taconic, Rogers*, Polyimide*, Kapton,Dupont Material Thickness ( in inches) 0.062", 0.08

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Price

Purchase Qty. Reference FOB Price

1-99 Pieces US$10.00

100-999 Pieces US$0.80

1,000-9,999 Pieces US$0.60

10,000+ Pieces US$0.03

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy Resin + Polyimide Resin
Application Consumer Electronics
Flame Retardant Properties V2
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Epoxy Resin
Brand New Chip
Transport Package Foam Packing
Specification FR4 1-4 Layers
Trademark New Chip
Origin China
Capacity 1000000
OEM/ODM Available
Sample Available
Surface Treatment OSP, Enig, HASL, AG Immersion
Certificate Gurantee Yes
Test 100%E-Testing
Min Bonding Pad Diameter 10mil
Min Thickness of Soldermask 10um
Color of Silk-Screen White, Yellow, Black
Data File Format Gerber File and Drilling File
Material for PCB Fr-4, High Tg Fr$, Halogen Free
Layer Count 1-20 Layers
Shipping DHL/UPS/FedEx/Air/Sea

Product Description

Company Service Specifications Details Material Type FR-4, CEM-1, CEM-3, Aluminium Clad,Arlon*,Teflon,Taconic, Rogers*, Polyimide*, Kapton,Dupont Material Thickness ( in inches) 0.062", 0.080", 0.093", 0.125", 0.220", 0.047", 0.031", 0.020", 0.005" Layer count 1 to 28 Layers Max. ...

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Shenzhen New Chip international Ltd

Gold Member Since 2022

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products PCB, PCBA, Component Chip
Year of Establishment 2022-05-11
Number of Employees 10
Address A904, plant 3, Longgang Tian'an Digital Innovation Park, No. 449, Huangge North Road, huanggekeng community, Longcheng street, Longgang District, Shenzhen

PCBA Manufacturing Comparison

	Manufacture Android Motherboard PCBA Assembly Contact Now	Quick View Shenzhen Factory Manufacturing Circuit Board Prototype Rigid Flexible PCB Solutions Contact Now	Quick View Smart Home System Fast Lead Time Prototype Rigid-Flex PCB Board Solutions Contact Now	Quick View High Quality Complex FPC Fabrication Prototype Rigid-Flexible PCB Board Solutions Contact Now	Quick View Polyimide Material Motherboard Circuit Board FPC Prototype Rigid Flex PCB Board Solutions Contact Now

Transaction Info
	Manufacture Android Motherboard PCBA Assembly Contact Now	Quick View Shenzhen Factory Manufacturing Circuit Board Prototype Rigid Flexible PCB Solutions Contact Now	Quick View Smart Home System Fast Lead Time Prototype Rigid-Flex PCB Board Solutions Contact Now	Quick View High Quality Complex FPC Fabrication Prototype Rigid-Flexible PCB Board Solutions Contact Now	Quick View Polyimide Material Motherboard Circuit Board FPC Prototype Rigid Flex PCB Board Solutions Contact Now
Price	US$0.03-10.00 / Piece	US$0.10-10.00 / Piece	US$0.10-10.00 / Piece	US$0.10-10.00 / Piece	US$0.10-10.00 / Piece
Min Order	1 Piece	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	T/T, PayPal, Western Union	T/T, PayPal, Western Union, Small-amount payment, VTB	T/T, PayPal, Western Union, Small-amount payment, VTB	T/T, PayPal, Western Union, Small-amount payment, VTB	T/T, PayPal, Western Union, Small-amount payment, VTB
Quality Control
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	North America, South America, Western Europe	North America, South America, Western Europe	North America, South America, Western Europe	North America, South America, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	ODM, OEM	-	-	-	-
Average Lead Time	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Capacity: 1000000; OEM/ODM: Available; Sample: Available; Surface Treatment: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes; Test: 100%E-Testing; Min Bonding Pad Diameter: 10mil; Min Thickness of Soldermask: 10um; Color of Silk-Screen: White, Yellow, Black; Data File Format: Gerber File and Drilling File; Material for PCB: Fr-4, High Tg Fr$, Halogen Free; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea;	Type: Flexible Circuit Board; Dielectric: No; Material: Polyimide; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Electrolytic Foil; Base Material: Polyimide; Insulation Materials: No; Brand: Exceeding Electronics;	Type: Flexible Circuit Board; Dielectric: No; Material: Polyimide; Application: Medical Instruments; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Electrolytic Foil; Base Material: Polyimide; Insulation Materials: No; Brand: Exceeding Electronics;	Type: Flexible Circuit Board; Dielectric: No; Material: Polyimide; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Electrolytic Foil; Base Material: Polyimide; Insulation Materials: No; Brand: Exceeding Electronics;	Type: Flexible Circuit Board; Dielectric: No; Material: Polyimide; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Electrolytic Foil; Base Material: Polyimide; Insulation Materials: No; Brand: Exceeding Electronics;
Supplier Name	Shenzhen New Chip international Ltd	EXCEEDING ELECTRONICS GROUP LIMITED	EXCEEDING ELECTRONICS GROUP LIMITED	EXCEEDING ELECTRONICS GROUP LIMITED	EXCEEDING ELECTRONICS GROUP LIMITED
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