| Specification |
Metal Coating: Gold;
Mode of Production: SMT+DIP;
Layers: 4;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Material: Fr-4(Tg135,Tg150,Tg170, Tg180,Tg250);
Number of Layers: 1-48 Layers;
Board Thickness: 0.2-6.0 mm;
Copper Thickness: 0.5-12 Oz;
Min Board Size: 5 X 5 mm;
Application: Communications, Industrial Control, Semiconductors;
Max Board Size: 900 X 600 mm;
Shipping Way: DHL,UPS,FedEx,by Sea;
Delivery Time: Within 3 Days(Sample);
MOQ: 1 PCS;
PCBA-Testing: Aoi,X-ray,Function Test;
Solder Resist Color: Green,Blue, Red,Yellow,Black,White,Orange,;
DIP Capacity: 100 Thousand Pins/Day;
Min BGA Ball Pitch: 0.4mm;
Surface Finishing: Lf Hal, OSP,Enig, Enepig,Immersion Silver;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
|
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
|
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
|
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
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