| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Mzh;
Board Thickness: 1.0mm, 1.6mm, 2.0mm, 2.4mm, 3.2mm;
Max Copper: 12 Oz;
Min Laser Holes: 0.1 mm;
Service: PCB+PCBA+Components+Reverse Engineer;
Surface Finishing: Lf Hal, OSP, Enig, Enepig, Immersion Silver;
Min Trace/Space: 3/3 Mil;
Solder Resist Color: Green, Blue, Red, Yellow, Black, White, Orange;
Inspection Standard: Ipc-II, Ipc-III, Ppap;
Fastest Delivery Time: 24 Hours (Sample);
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Type: Double Sided PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4,Tg,Cem-1,Aluminium;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Smart;
Number of Layers: 2/4/6/8/12/14or Custom;
Shape: Rectangular, Round, Slots, Cutouts, Complex Irramu;
Copper Thickness: 0.5-6.0oz;
Min. Hole Size: 0.1mm;
Min.Line Spacing: Standard;
Hole Spacing: 2.54mm;
Board Size: Please Contact Us;
Min.Line Width: 0.15mm;
Board Thickness: 0.2-4.0mm;
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Type: Double Sided PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4,Tg,Cem-1,Aluminium;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Smart;
Number of Layers: 2/4/6/8/12/14or Custom;
Copper Thickness: 0.5-6.0oz;
Min. Hole Size: 0.1mm;
Min.Line Width: 0.15mm;
Hole Spacing: 2.54mm;
Board Thickness: 0.2-4.0mm;
Surface Finishing: Double Sided Tin Spraying;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr-4;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Smart;
Number of Layers: 2/4/6/8/12/14or Custom;
Copper Thickness: 0.5-6.0oz;
Min.Hole Size: 0.1mm;
Min.Line Spacing: 0.075mm or 3mil;
Board Thickness: 0.2~4.0mm;
Surface Finishing: HASL;
Min.Line Width: 0.15mm;
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Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Xinguanghui;
Weight: 250kg;
Power: AC220V;
Maximum Machining Size: 640*640mm;
Minimum Machining Size: 50*50mm;
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