| Specification |
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Material: Fr-4(Tg135, Tg150, Tg170, Tg180, Tg250);
Number of Layers: 1-48 Layers;
Board Thickness: 0.2-6.0 mm;
Copper Thickness: 0.5-12 Oz;
Service: PCB+PCBA+Components+Reverse Engineer;
Application: Communications, Industrial Control, Semiconductors;
Min Board Size: 5 X 5 mm;
Max Board Size: 900 X 600 mm;
Min Hole Size: 0.15 mm;
Surface Finishing: Lf Hal, OSP, Enig, Enepig, Immersion Silver;
Min BGA Ball Pitch: 0.4mm;
DIP Capacity: 100 Thousand Pins/Day;
Solder Resist Color: Green, Blue, Red, Yellow, Black, White, Orange;
PCBA-Testing: Aoi, X-ray, Function Test;
Delivery Time: Within 3 Days(Sample);
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Product Name: DC Inverter Heat Pump Control Board;
Texture of Material: Fiberglass Board, Copper, Tin, Ferrite and Ceramic;
Board Thickness: 1.6mm;
Copper Thickness: 1 Oz;
Min. Hole Size: Component Hole:0.6-2.0mm, Mounting Hole: 4mm;
Min. Line Width: More Than 0.3mm;
Min. Line Spacing: More Than 0.3mm;
Surface Finishing: Lead Free;
Power Supply: 380±10%(VAC), 50/60Hz;
Sensor: Ntc(5kΩ/25°C, B Value 3470K;50K/25°C;
Output Capacity of Relay: 10A/240VAC, 15A/250VAC;
Protection Function: Discharge Super Heat Temperature Ect;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Product Name: DC Inverter Heat Pump Control Board;
Application: Household Heat Pump Water Heater;
Power Supply: 400VAC/50Hz;
Sensor Type: Ntc;
Control Mode: Cooling, Heating, Dhw and Floor Heating;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Small Order: Acceptable;
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Material: Complex;
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