| Specification |
Metal Coating: Gold;
Mode of Production: SMT+DIP;
Layers: Multilayer;
Base Material: Fr-4(Tg135,Tg150,Tg170, Tg180,Tg250);
Customized: Customized;
Condition: Used;
Shipping Way: by Air--DHL, UPS, FedEx;
Inspection Standardtype: Ipc-II, Ipc-III, Ppap;
Solder Resist Color: Green, Blue, Red, Yellow, Black, White, Orange;
Copper Thickness: 0.5-12 Oz;
Service: PCB+PCBA+Components+Reverse Engineer;
Application: Communications, Industrial Control, Semiconductors;
Surface Finishing: Lf Hal, OSP, Enig, Enepig, Immersion Silver;
Material: Fr-4, Rogers, Arlon;
Number of Layers: 1-48 Layers;
Board Thickness: 0.2-6.0 mm;
Min Board Size: 5 X 5 mm;
Max Board Size: 900 X 600 mm;
Min Laser Holes: 0.1 mm;
Aspect Ratio: 20:1;
Delivery Time: Within 3 Days(Sample);
|
Metal Coating: Enig / HASL / OSP / Silver etc.;
Mode of Production: SMT / DIP / Customized;
Layers: From 2 Layers to 50 Layers;
Base Material: Fr4/ High Tg Fr4/ Metal Core / Cem;
Customized: Customized;
Condition: New;
Solder Mask Color: Green,Blue,Yellow,White,Black,Red;
Special Process: Buried Hole, Blind Hole, Partial High Density, Bac;
Copper Thickness: 1/2oz,1oz,2oz,3oz,4oz,5oz-10 Oz;
Layer Count: 1-50 Layers;
Quality Standard: Ipc Class 2 and Ipc Class 3;
|
Metal Coating: Enig / HASL / OSP / Silver etc.;
Mode of Production: SMT / DIP / Customized;
Layers: From 2 Layers to 50 Layers;
Base Material: Fr4/ High Tg Fr4/ Metal Core / Cem;
Customized: Customized;
Condition: New;
Solder Mask Color: Green,Blue,Yellow,White,Black,Red;
Special Process: Buried Hole, Blind Hole, Partial High Density, Bac;
Copper Thickness: 1/2oz,1oz,2oz,3oz,4oz,5oz-10 Oz;
Layer Count: 1-50 Layers;
Quality Standard: Ipc Class 2 and Ipc Class 3;
|
Customized: Customized;
Condition: New;
Solder Mask Color: Green, Blue, Yellow, White, Black, Red;
Special Process: Buried Hole, Blind Hole, Partial High Density, Bac;
Copper Thickness: 1/2oz, 1oz, 2oz, 3oz, 4oz, 5oz-10 Oz;
Layer Count: 1-50 Layers;
Quality Standard: Ipc Class 2 and Ipc Class 3;
|
Customized: Customized;
Condition: New;
Solder Mask Color: Green,Blue,Yellow,White,Black,Red;
Special Process: Buried Hole, Blind Hole, Partial High Density, Bac;
Copper Thickness: 1/2oz,1oz,2oz,3oz,4oz,5oz-10 Oz;
Layer Count: 1-50 Layers;
Quality Standard: Ipc Class 2 and Ipc Class 3;
|