PCBA

US$0.50-1.00 / Piece

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What is Mustar Network Function Virtualization (NFV) Ready PCBA with 12-Layer High-Speed Interconnect and Broadr-Reach Automotive Ethernet Compliance for Telecom System

Name: Mustar Network Function Virtualization (NFV) Ready PCBA with 12-Layer High-Speed Interconnect and Broadr-Reach Automotive Ethernet Compliance for Telecom System
Uploaded: 2026-04-02T19:00:31+08:00
Description: Product Parameters Category Details Company Name Mu Star (Shenzhen) Industry Co., LTD Advantages - Testing & Packaging Program and functional test and package for free Advantages - Quality Standard IP

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Price

Purchase Qty. Reference FOB Price

10-49 Pieces US$1.00

50-99 Pieces US$0.80

100-499 Pieces US$0.70

500-999 Pieces US$0.60

1,000+ Pieces US$0.50

Sepcifications

Type Combining Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Aerospace
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Aluminum
Insulation Materials Organic Resin
Brand Mustar
Transport Package Carton
Specification oem
Trademark Mustar
Origin Shen Zhen
D/C Standard
Condition New Original
Warranty 2 Years
Mountng Type SMT ,DIP
Memory Type Standard

Product Description

Product Parameters Category Details Company Name Mu Star (Shenzhen) Industry Co., LTD Advantages - Testing &Packaging Program and functional test and package for free Advantages - Quality Standard IPC - A - 610E standard, E - test, X - ray, AOI test, QC, 100% functional test Advantages - ...

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Mu Star (shenzhen) Industry Co., Ltd.

Diamond Member Since 2023

Audited Supplier

Business Type Trading Company
Main Products PCBA, PCB Assembly, PCB, Electronic Component, IC
Year of Establishment 2021-12-16
Number of Employees 35
Address Room 602, Building C, Shenzhen Qianwan Hard Technology Industrial Park, Bao'an District, Shenzhen

PCBA Comparison

	Mustar Network Function Virtualization (NFV) Ready PCBA with 12-Layer High-Speed Interconnect and Broadr-Reach Automotive Ethernet Compliance for Telecom System Contact Now	Quick View Turnkey Electronic PCB Assembly Service Multi - Layer PCBA for Complex Circuit Designs Contact Now	Quick View Multi Layer Fr4 94V0 PCB Board Assembly with High Quality UL RoHS Certification Contact Now	Quick View PCBA R&D Manufacture Electric Oven Control Panel Oven Circuit Board with One- Stop SMT DIP Services Contact Now	Quick View Multilayer PCBA Contract Manufacturing Printed Circuit Board Assembly for Bluetooth Speaker Contact Now

Transaction Info
	Mustar Network Function Virtualization (NFV) Ready PCBA with 12-Layer High-Speed Interconnect and Broadr-Reach Automotive Ethernet Compliance for Telecom System Contact Now	Quick View Turnkey Electronic PCB Assembly Service Multi - Layer PCBA for Complex Circuit Designs Contact Now	Quick View Multi Layer Fr4 94V0 PCB Board Assembly with High Quality UL RoHS Certification Contact Now	Quick View PCBA R&D Manufacture Electric Oven Control Panel Oven Circuit Board with One- Stop SMT DIP Services Contact Now	Quick View Multilayer PCBA Contract Manufacturing Printed Circuit Board Assembly for Bluetooth Speaker Contact Now
Price	US$0.50-1.00 / Piece	US$0.56-5.00 / Piece	US$0.67-5.00 / Piece	US$0.98-5.00 / Piece	US$0.15-10.00 / Piece
Min Order	10 Pieces	10 Pieces	10 Pieces	10 Pieces	10 Pieces
Payment Terms	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	T/T	T/T	T/T	T/T
Quality Control
Product Certification	-	RoHS, CCC, ISO	RoHS, CCC, ISO	RoHS, CCC, ISO	RoHS, CCC, ISO
Management System Certification	-	ISO9001:2015	ISO9001:2015	ISO9001:2015	ISO9001:2015
Trade Capacity
Export Markets	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea)	Domestic	Domestic	Domestic	Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	-	ODM, OEM	ODM, OEM	ODM, OEM	ODM, OEM
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: one month	Peak Season Lead Time: one month Off Season Lead Time: one month	Peak Season Lead Time: one month Off Season Lead Time: one month	Peak Season Lead Time: one month Off Season Lead Time: one month
Product Attributes
Specification	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: Mustar; D/C: Standard; Condition: New Original; Warranty: 2 Years; Mountng Type: SMT ,DIP; Memory Type: Standard;	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;
Supplier Name	Mu Star (shenzhen) Industry Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.
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