PCBA

US$0.325-3.655 / Piece

Customized Multilayer PCB Circuit Boards PCB Board Design Ai Artificial Intelligence Multilayer pictures & photos

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What is Customized Multilayer PCB Circuit Boards PCB Board Design Ai Artificial Intelligence Multilayer

Name: Customized Multilayer PCB Circuit Boards PCB Board Design Ai Artificial Intelligence Multilayer
Uploaded: 2026-03-22T16:02:28+08:00
Description: ... Shenzhen Jingxin Electronic Technology Co.,Ltd. ... Built since 2002, is a almost 20 years professional company dedicating to PCB&PCBA industry. Our factory located in Shenzhen, and have dust-free

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About this Item

Price

Purchase Qty. Reference FOB Price

1-99 Pieces US$3.655

100-999 Pieces US$2.654

1,000-9,999 Pieces US$1.355

10,000+ Pieces US$0.325

Sepcifications

Metal Coating Copper
Mode of Production SMT
Layers Double-Layer
Base Material FR-4
Certification RoHS
Customized Customized
Condition New
Transport Package Carton
Specification 20g
Trademark jinxin
Origin Shenzhen
PCB QA E-Test, Aoi, X-ray, Function Test
Sample Date 5-7days
Shipment Air, Sea, Express(DHL TNT FedEx EMS UPS
Surface Treatment Gold Finger/Hard Gold
Board Thickness 0.2-6mm
Copper Thickness 0.5-12oz(18-420um)
Solder Mask Color Green/Black/White/Red/Blue/Yellow
Hole Diameter Min0.05mm
Min. Line Width 0.10mm(4mil)
Min. Line Spacing 0.10mm(4mil)
Test 100% E-Test
One Stop Service PCB Assembly, Component Sourcing, Box Building
Max. Finished Board Side 1020mm*1000mm
MOQ No
SMT Machine Siemens Siplace D1/D2 / Siemens Siplace S20/F4

Product Description

... Shenzhen Jingxin Electronic Technology Co.,Ltd. ... Built since 2002, is a almost 20 years professional company dedicating to PCB&PCBA industry. Our factory located in Shenzhen, and have dust-free workshop which cover an area of over than 10000m2, almost 550 employees, more than 30 production ...

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Shenzhen Jingxin Electronic Technology Co., Ltd.

Diamond Member Since 2022

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products PCBA, PCB, Print Circuit Board, Flexible Circuit Board, Rigid PCB Assembly, PCB Assembly, ...
Year of Establishment 2006-08-03
Number of Employees 423
Management System Certification Others
Address 1-5f, Building 17, 2-3f, Building 13 Hongfa Industrial Park, Tangtou, Shenzhen, Guangdong, China

PCBA Comparison

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Transaction Info
	Customized Multilayer PCB Circuit Boards PCB Board Design Ai Artificial Intelligence Multilayer Contact Now	Quick View Professional Manufacture PCB Assembly Factory Medical Equipment PCBA Board Contact Now	Quick View OEM PCBA Bom Gerber File Service Electronic Components PCB Assembly Manufacture Contact Now	Quick View OEM Contract Manufacturing Android PCBA Electronic Design Assembly Services Contact Now	Quick View PCBA Manufacturing Service SMT Bom Gerber Ai OEM Custom Prototype PCBA Assembly Contact Now
Price	US$0.325-3.655 / Piece	US$0.20-20.00 / Piece	US$0.87-5.00 / Piece	US$0.76-5.00 / Piece	US$2.15-5.00 / Piece
Min Order	1 Piece	10 Pieces	10 Pieces	10 Pieces	10 Pieces
Payment Terms	LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram	T/T	T/T	T/T	T/T
Quality Control
Product Certification	RoHS	RoHS, ISO	RoHS, CCC, ISO	RoHS, ISO	RoHS, ISO
Management System Certification	Others	ISO9001:2015	ISO9001:2015	ISO9001:2015	ISO9001:2015
Trade Capacity
Export Markets	North America, Eastern Europe, Africa, Mid East, Western Europe	Domestic	Domestic	Domestic	Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	Own Brand, ODM, OEM	ODM, OEM	ODM, OEM	ODM, OEM	ODM, OEM
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: one month	Peak Season Lead Time: one month Off Season Lead Time: one month	Peak Season Lead Time: one month Off Season Lead Time: one month	Peak Season Lead Time: one month Off Season Lead Time: one month
Product Attributes
Specification	Metal Coating: Copper; Mode of Production: SMT; Layers: Double-Layer; Base Material: FR-4; Customized: Customized; Condition: New; PCB QA: E-Test, Aoi, X-ray, Function Test; Sample Date: 5-7days; Shipment: Air, Sea, Express(DHL TNT FedEx EMS UPS; Surface Treatment: Gold Finger/Hard Gold; Board Thickness: 0.2-6mm; Copper Thickness: 0.5-12oz(18-420um); Solder Mask Color: Green/Black/White/Red/Blue/Yellow; Hole Diameter: Min0.05mm; Min. Line Width: 0.10mm(4mil); Min. Line Spacing: 0.10mm(4mil); Test: 100% E-Test; One Stop Service: PCB Assembly, Component Sourcing, Box Building; Max. Finished Board Side: 1020mm1000mm;* MOQ: No; SMT Machine: Siemens Siplace D1/D2 / Siemens Siplace S20/F4;	Metal Coating: Copper; Mode of Production: SMT; Layers: Multilayer; Base Material: FR-4; Customized: Customized; Condition: New; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Metal Coating: Copper; Mode of Production: SMT; Layers: Multilayer; Base Material: FR-4; Customized: Customized; Condition: New; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Metal Coating: Copper; Mode of Production: SMT; Layers: Multilayer; Base Material: FR-4; Customized: Customized; Condition: New; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Metal Coating: Copper; Mode of Production: SMT; Layers: Multilayer; Base Material: FR-4; Customized: Customized; Condition: New; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;
Supplier Name	Shenzhen Jingxin Electronic Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.
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