Shenzhen Electronics

US$0.69-2.34 / Piece

Turnkey PCBA Service for Fr4 Multilayer PCB with SMT&DIP Process Custormized PCBA pictures & photos

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What is Turnkey PCBA Service for Fr4 Multilayer PCB with SMT&DIP Process Custormized PCBA

Name: Turnkey PCBA Service for Fr4 Multilayer PCB with SMT&DIP Process Custormized PCBA
Uploaded: 2026-03-24T10:04:33+08:00
Description: Product Description Specification: PCB layers: 1-24layers PCB materials: CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free PCB max. board size: 620*1100mm PCB certificate: RoHS

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Price

Purchase Qty. Reference FOB Price

10-99 Pieces US$2.34

100-999 Pieces US$1.85

1,000-1,999 Pieces US$1.25

2,000+ Pieces US$0.69

Sepcifications

Type Combining Rigid Circuit Board
Dielectric FR-4
Material Aluminum Covered Copper Foil Layer
Application Consumer Electronics
Flame Retardant Properties V1
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Metal Composite Materials
Brand Jxpcba
Transport Package Customized, ESD Bag/Vacuum Packaging+Bubble Bag,
Specification Custom HDI PCBA
Trademark JXpcba
Origin China
Product Type Custom HDI PCBA
Service One-Stop Turnkey
Applicational Electronics Device/Home Appliances
Testing Service Aoi X-ray Function Test
Raw Material Fr4/Cem-1/Cem-3/Fr1/Aluminum
Board Thickness 0.2mm-7.0mm
Layer 1-32 Layers
Solder Mask Color Blue.Green.Red.Black.White.etc
Surface Finishing HASL\OSP\Immersion Gold
Certificate ISO9001/ISO14001/CE/RoHS
PCB Solder Mask White, Black, Yellow, Green, Red, Blue
Component Packing Tary, Tube, Tape
Maximum Board Size 640mm*1100mm
PCBA Test Static Test, Power-on Function Test, Power-on Agin
PCB Silkscreen Color Black, White, Yellow

Product Description

Product Description Specification: PCB layers: 1-24layers PCB materials: CEM1, CEM3, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free PCB max. board size: 620*1100mm PCB certificate: RoHS Directive-Compliant PCB Thickness: 1.6 ±0.1mm Out Layer Copper Thickness: 0.5-5oz ...

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Shenzhen Jingxin Electronic Technology Co., Ltd.

Diamond Member Since 2022

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products PCBA, PCB, Print Circuit Board, Flexible Circuit Board, Rigid PCB Assembly, PCB Assembly, ...
Year of Establishment 2006-08-03
Number of Employees 423
Management System Certification Others
Address 1-5f, Building 17, 2-3f, Building 13 Hongfa Industrial Park, Tangtou, Shenzhen, Guangdong, China

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Transaction Info
	Turnkey PCBA Service for Fr4 Multilayer PCB with SMT&DIP Process Custormized PCBA Contact Now	Electronic Consumer Circuit Board Multilayer Washing Machine PCB High Frequency Other PCB PCBA Manufacturer Contact Now	Quick View One Stop Customized Design Toy Music Doorbell USB Spray Module Ultrasonic Humidifier PCBA Assembly Manufacturer Contact Now	Quick View Support One-Stop OEM Service Multilayer PCB PCBA Circuit Board Assembly Manufacturer PCBA Contact Now	Quick View Mk08 BLE Bluetooth Lower Energy Nrf52840 Module Bluetooth5.0/5.1 Specification BLE Solution Wireless Module Contact Now
Price	US$0.69-2.34 / Piece	US$0.50-1.00 / Piece	US$0.50-6.00 / Piece	US$0.50-6.00 / Piece	US$0.10-0.50 / Piece
Min Order	10 Pieces	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram	T/T, PayPal, Western Union	T/T, PayPal, Western Union	T/T, PayPal, Western Union	T/T, PayPal, Western Union
Quality Control
Product Certification	ISO9001/ISO14001/CE/RoHS	-	-	-	-
Management System Certification	Others	-	-	-	-
Trade Capacity
Export Markets	North America, Eastern Europe, Africa, Mid East, Western Europe	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia
Annual Export Revenue	-	-	-	-	-
Business Model	Own Brand, ODM, OEM	ODM, OEM	ODM, OEM	ODM, OEM	ODM, OEM
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V1; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Metal Composite Materials; Brand: Jxpcba; Product Type: Custom HDI PCBA; Service: One-Stop Turnkey; Applicational: Electronics Device/Home Appliances; Testing Service: Aoi X-ray Function Test; Raw Material: Fr4/Cem-1/Cem-3/Fr1/Aluminum; Board Thickness: 0.2mm-7.0mm; Layer: 1-32 Layers; Solder Mask Color: Blue.Green.Red.Black.White.etc; Surface Finishing: HASL\OSP\Immersion Gold; PCB Solder Mask: White, Black, Yellow, Green, Red, Blue; Component Packing: Tary, Tube, Tape; Maximum Board Size: 640mm1100mm;* PCBA Test: Static Test, Power-on Function Test, Power-on Agin; PCB Silkscreen Color: Black, White, Yellow;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Capacity: 1000000; OEM/ODM: Available; Sample: Available; Surface Treatment: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes; Test: 100%E-Testing; Min Bonding Pad Diameter: 10mil; Min Thickness of Soldermask: 10um; Color of Silk-Screen: White, Yellow, Black; Data File Format: Gerber File and Drilling File, Protel Series, ...; Material for PCB: Fr-4, Halogen Free, Rogers, Cem-1, Ari; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Capacity: 1000000; OEM/ODM: Available; Sample: Available; Surface Treatment: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes; Test: 100%E-Testing; Min Bonding Pad Diameter: 10mil; Min Thickness of Soldermask: 10um; Color of Silk-Screen: White, Yellow, Black; Data File Format: Gerber File and Drilling File, Protel Series, ...; Material for PCB: Fr-4, Halogen Free, Rogers, Cem-1, Ari; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Capacity: 1000000; OEM/ODM: Available; Sample: Available; Surface Treatment: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes; Test: 100%E-Testing; Min Bonding Pad Diameter: 10mil; Min Thickness of Soldermask: 10um; Color of Silk-Screen: White, Yellow, Black; Data File Format: Gerber File and Drilling File, Protel Series, ...; Material for PCB: Fr-4, Halogen Free, Rogers, Cem-1, Ari; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea;	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin;
Supplier Name	Shenzhen Jingxin Electronic Technology Co., Ltd.	Shenzhen New Chip international Ltd	Shenzhen New Chip international Ltd	Shenzhen New Chip international Ltd	Shenzhen New Chip international Ltd
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