| Specification |
Type: Rigid Circuit Board;
Dielectric: CEM-3;
Material: Paper Phenolic Copper Foil Substrate;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Model: ROVO;
Brand: Customer Brand;
PCB Shape: Any Shape;
PCB Thickness: 0.3-0.4mm;
Outer Packing: Standard Carton Packing;
Inner Packing: Vacuum Packing;
Capacity: 50 Million Points Daily Output;
PCB Layer: 1-32;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Model: PCB;
Silkscreen: White, Black, Red;
Solder Mask: Green, Yellow, Red, White, Black, Blue;
Surface Finishing: HASL, Lf-Hal, Immerion Tin, Immerion Gold, OSP;
Board Thickness: 1.6mm;
Copper Thickness: 35um;
Min Line Spacing: 0.2mm;
Min Line Width: 0.2mm;
Min Hole Size: 0.25mm;
Package: Vacuum;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Solder Mask: Green,White, Black, Red;
Silkscreen: Green,White, Black, Red;
PCB Material Thickness: 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm, 2.0mm, 3.2mm;
Surface Finishing: HASL, Lf-Hal, Immerion Tin, Immerion Gold, OSP;
Min. Hole Size: 0.25mm;
Min. Line Width: 0.1mm;
Min. Line Spacing: 0.1mm;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Certificates: UL, RoHS, SGS, ISO9001;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Model: PCB;
Board Thickness: 1.6mm;
Layer: 1 to 28 Layers;
Meterial Type: Fr-4,Cem-1,High Tg,Fr4 Halogen Free,Rogers;
Copper Thickness: 1.0oz;
Min Line Width: 0.075mm;
Min Line Spacing: 0.075mm;
Min Hole Size: 0.075;
Surface Finishing: Immersion Gold;
Package: Vacuum;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Model: PCB;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Min Line Width: 0.1mm;
Min Line Spacing: 0.1mm;
Min Hole Size: 0.2mm;
Surface Finishing: HASL;
PCB Board Type: Rigid;
Lead Time: 3 to 7 Day;
Color: Green/Whitr/Black,Ect;
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