Mini PC

US$197.15-227.81 / units

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Name: Hystou Factory Direct Wholesale Embedded 16GB DDR4 RAM SSD Fanless Firewall Router Mini PC Intel Core I3 Desktop Industrial Computer
Uploaded: 2026-03-31T12:26:04+08:00
Description: Product Picture HYSTOU Fanless Industrial Mini PC Core i3 i5 i7 Rich interfaces to respond to the needs Fanless Industrial PC H6 is equipped with 6*USB, 2*COM, 2*LAN, 1*DP, 2*HD interfaces, etc. U

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About this Item

Price

Purchase Qty. Reference FOB Price

1-9 units US$227.81

10-99 units US$212.54

100+ units US$197.15

Sepcifications

Application Field Industrial Control
Processor Type Intel
Stratification HardWare Layer
Range of Application General
Certification CE, RoHS, FCC
Type Embedded Systems
Machine Word-Length 8
Instruction Type RISC
Transport Package Standard Color Express Box
Specification PC size 205*125*53mm Package size 308*206*75mm
Trademark HYSTOU
Origin Guangdong, China
CPU Intel Core I3-10110u
GPU Intel UHD Graphics
Hard Drive Type SSD+HDD
RAM Type DDR4
LAN 2*RJ45 LAN
USB Port 2*USB 2.0 Port, 4*USB 3.0 Port
OS Windows 10/11, Linux
Use Industrial
Plugs Type Us, Jp, Cn, Au, UK, EU
Material Aluminum Alloy
Graphics Card Chipset Integrated Card
Video Memory 2 GB
Warranty(Year) 3-Year
Weight Net 1.2kg; Gross 1.9kg

Product Description

Product Picture HYSTOU Fanless Industrial Mini PC Core i3 i5 i7 Rich interfaces to respond to the needs Fanless Industrial PC H6 is equipped with 6*USB, 2*COM, 2*LAN, 1*DP, 2*HD interfaces, etc. USB3.0 transmission speed is fast, which improves your work efficiency and saves your time. It ...

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Shenzhen Fannis Technology Co., Ltd

Diamond Member Since 2024

Audited Supplier

Rating & Reviews: 5.0/5.0

(12 Reviews)

Main Products Mini PC, Fanless Computer, Industrial PC, All in One PC, Touch Screen Industrial Panel PC, ...
Address 10th Floor, Building a, Sanhuan Technology Building, No. 1, Dongchang Road and Tongren Road, Guangming District, Shenzhen City, Guangdong Province, Shenzhen, Guangdong, China
Main Markets North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Western Europe
International Commercial Terms(Incoterms) FOB, EXW, CIF, DDP, DAP, FCA
Terms of Payment LC, T/T, PayPal, Western Union, Money Gram, Visa Card
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Mini PC Comparison

	Hystou Factory Direct Wholesale Embedded 16GB DDR4 RAM SSD Fanless Firewall Router Mini PC Intel Core I3 Desktop Industrial Computer Contact Now	Quick View Rk3588 PCB Manufacturing and Assembly 6tops Computingpower Circuit Board Android Development Board Contact Now	Quick View Rk 3588 Android OEM Board Aiot Embedded System Development Board Contact Now	Quick View Custom System on Module Rockchip 3576 Som Tablet Board Rk3576 Som Board 8nm 6 Tops Npu Som Module Contact Now	Quick View Custom Android Sbc Rk3576s 8nm 6 Tops Npu RJ45 Uart WiFi 6 Android Sbc Development Board Rk3576s Som with Carrier Board Contact Now

Transaction Info
	Hystou Factory Direct Wholesale Embedded 16GB DDR4 RAM SSD Fanless Firewall Router Mini PC Intel Core I3 Desktop Industrial Computer Contact Now	Quick View Rk3588 PCB Manufacturing and Assembly 6tops Computingpower Circuit Board Android Development Board Contact Now	Quick View Rk 3588 Android OEM Board Aiot Embedded System Development Board Contact Now	Quick View Custom System on Module Rockchip 3576 Som Tablet Board Rk3576 Som Board 8nm 6 Tops Npu Som Module Contact Now	Quick View Custom Android Sbc Rk3576s 8nm 6 Tops Npu RJ45 Uart WiFi 6 Android Sbc Development Board Rk3576s Som with Carrier Board Contact Now
Price	US$197.15-227.81 / units	US$121.00-160.00 / Piece	US$85.00-112.00 / Piece	US$50.00-67.00 / Piece	US$68.00-91.00 / Piece
Min Order	1 units	2 Pieces	2 Pieces	2 Pieces	2 Pieces
Payment Terms	LC, T/T, PayPal, Western Union, Money Gram, Visa Card	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, D/P, PayPal, Western Union, Small-amount payment
Quality Control
Product Certification	CE, RoHS, FCC	CE, RoHS, FCC	CE, RoHS, FCC	CE, RoHS, FCC	CE, RoHS, FCC
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Western Europe	North America, Eastern Europe, Oceania, Mid East, Western Europe, Southeast Asia	North America, Eastern Europe, Oceania, Mid East, Western Europe, Southeast Asia	North America, Eastern Europe, Oceania, Mid East, Western Europe, Southeast Asia	North America, Eastern Europe, Oceania, Mid East, Western Europe, Southeast Asia
Annual Export Revenue	-	-	-	-	-
Business Model	ODM	ODM, OEM	ODM, OEM	ODM, OEM	ODM, OEM
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Application Field: Industrial Control; Processor Type: Intel; Stratification: HardWare Layer; Range of Application: General; Type: Embedded Systems; Machine Word-Length: 8; Instruction Type: RISC; CPU: Intel Core I3-10110u; GPU: Intel UHD Graphics; Hard Drive Type: SSD+HDD; RAM Type: DDR4; LAN: 2RJ45 LAN;* USB Port: 2USB 2.0 Port, 4USB 3.0 Port; OS: Windows 10/11, Linux; Use: Industrial; Plugs Type: Us, Jp, Cn, Au, UK, EU; Material: Aluminum Alloy; Graphics Card Chipset: Integrated Card; Video Memory: 2 GB; Warranty(Year): 3-Year; Weight: Net 1.2kg; Gross 1.9kg;	Application Field: Industrial Control; Processor Type: ARM; Stratification: HardWare Layer; Range of Application: General; Type: System on Module; Kernel: PIC; Product Type: System on Module Som+ Carrier Board; Processor: Rockchip Rk3588s, 8nm, Octa-Core (4xa76 + 4xa55); OS: Android 13 Debian 11.6; GPU: Mali-G610 MP4, 450 Gflops; Npu Computing Power: 6.0 Tops, Int4/Int8/Int16; Memory: Lpddr4 4GB/8GB/16GB/32GB; Storage: Emmc 64GB/128GB/256GB; Video Decode: 8K@60fps H.265/Vp9, 8K@30fps H.264, 4K AV1; Expansion: Pcie 3.0, SATA3.0, USB3.1, USB3.0; Networking: 2xgigabit Ethernet, WiFi 6, Bt 5.0 (Carrier Board); Applications: Ai, Edge Computing, Robotics, Industrial Automatio; Audio: Can Be Customized; Input Power: The Carrier Board Can Be Customized; Customization Services: OS Debugging, Interfaces/Storage/Wireless Custom; Environment: Operating Temperature -20°c ~ 60°c;	Application Field: Industrial Control; Processor Type: ARM; Stratification: HardWare Layer; Range of Application: General; Type: System on Module; Kernel: PIC; Product Type: System on Module Som+ Carrier Board; Processor: Rockchip Rk3588s, 8nm, Octa-Core (4xa76 + 4xa55); OS: Android 13 Debian 11.6; GPU: Mali-G610 MP4, 450 Gflops; Npu Computing Power: 6.0 Tops, Int4/Int8/Int16; Memory: Lpddr4 4GB/8GB/16GB/32GB; Storage: Emmc 64GB/128GB/256GB; Video Decode: 8K@60fps H.265/Vp9, 8K@30fps H.264, 4K AV1; Expansion: Pcie 3.0, SATA3.0, USB3.1, USB3.0; Networking: 2xgigabit Ethernet, WiFi 6, Bt 5.0 (Carrier Board); Applications: Ai, Edge Computing, Robotics, Industrial Automatio; Audio: Can Be Customized; Input Power: The Carrier Board Can Be Customized; Customization Services: OS Debugging, Interfaces/Storage/Wireless Custom; Environment: Operating Temperature -20°c ~ 60°c;	Application Field: Industrial Control; Processor Type: ARM; Stratification: HardWare Layer; Range of Application: General; Type: System on Module; Kernel: PIC; Product Type: System on Module Som; Processor: Rockchip Rk3576, 8nm, Octa-Core (4xa72 + 4xa53); OS: Android 14; Npu Computing Power: 6.0 Tops, Int4/Int8/Int16; Memory: Lpddr4 4GB/8GB/16GB/32GB; Storage: Emmc 64GB/128GB/256GB; Expansion: Pcie 3.0, SATA3.0, USB3.1, USB3.0; Networking: 2xgigabit Ethernet, WiFi 6, Bt 5.0 (Carrier Board); Applications: Ai, Edge Computing, Robotics, Industrial Automatio; Audio: Can Be Customized; Input Power: The Carrier Board Can Be Customized; Customization Services: OS Debugging, Interfaces/Storage/Wireless Custom; Environment: Operating Temperature -20°c ~ 60°c;	Application Field: Industrial Control; Processor Type: ARM; Stratification: HardWare Layer; Range of Application: General; Type: System on Module; Kernel: PIC; Product Type: System on Module Som+ Carrier Board; Processor: Rockchip Rk3576, 8nm, Octa-Core (4xa72 + 4xa53); OS: Android 14; GPU: Arm Mali-G52 Mc3; Npu Computing Power: 6.0 Tops, Int4/Int8/Int16; Memory: Lpddr4 4GB/8GB/16GB/32GB; Storage: Emmc 64GB/128GB/256GB; Video Decode: 8K@60fps H.265/Vp9, 8K@30fps H.264, 4K AV1; Expansion: Pcie 3.0, SATA3.0, USB3.1, USB3.0; Networking: 2xgigabit Ethernet, WiFi 6, Bt 5.0 (Carrier Board); Applications: Ai, Edge Computing, Robotics, Industrial Automatio; Audio: Can Be Customized; Input Power: The Carrier Board Can Be Customized; Customization Services: OS Debugging, Interfaces/Storage/Wireless Custom; Environment: Operating Temperature -20°c ~ 60°c;
Supplier Name	Shenzhen Fannis Technology Co., Ltd	Shenzhen Pretech Industrial Co., Ltd.	Shenzhen Pretech Industrial Co., Ltd.	Shenzhen Pretech Industrial Co., Ltd.	Shenzhen Pretech Industrial Co., Ltd.
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