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      6USB Mini Computer
      US$178.37-211.28 / units
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      What is Hystou Dual Display 6USB K4 Intel Corei7 8th Gen 6COM 4K Display Embedded Desktop Computer Industrial Rugged Mini PC

      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      1-9 units US$211.28

      10-99 units US$196.96

      100+ units US$178.37

      Sepcifications

      • Application Field Industrial Control
      • Processor Type Intel
      • Stratification HardWare Layer
      • Range of Application General
      • Certification CE, RoHS, FCC
      • Type Embedded Systems
      • Machine Word-Length 8
      • Instruction Type RISC
      • Transport Package Normal Color Express Box
      • Specification PC size 240*150*57mm Package size 320*260*80mm
      • Trademark HYSTOU
      • Origin Guangdong, China
      • CPU Intel Core I7-8550u
      • Video Card Intel HD Graphics 4400
      • Warranty(Year) 3-Year
      • Hard Drive Type SSD+HDD
      • RAM Type DDR3
      • COM 6*RS232 COM Port
      • OS Linux/Win10/Win7
      • Use Industrial
      • USB Port 4*USB 3.0 Port+ 2*USB 2.0 Port
      • Storage 1*Msata+1*2.5 Inch SATA HDD
      • LAN 2* RJ45 LAN
      • Video Memory 2 GB
      • RAM 16GB Max
      • Display 1*HD+1*VGA

      Product Description

      VR Product Picture HYSTOU 6 Com Ports VGA HD-MI Dual Display Fanless Mini Industrial PC The K4 Mini PC is a new series of industrial PCs to be launched by HYSTOU in early 2020, similar to the P04B but smaller in size. This miniature industrial PC supports multiple CPU types. Unique Fanless ...

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      6USB Mini Computer Comparison
      Transaction Info
      Price US$178.37-211.28 / units US$50.00-67.00 / Piece US$50.00-67.00 / Piece US$89.00-129.00 / Piece US$260.00-280.00 / Piece
      Min Order 1 units 2 Pieces 2 Pieces 2 Pieces 1 Piece
      Payment Terms LC, T/T, PayPal, Western Union, Money Gram, Visa Card LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment
      Quality Control
      Product Certification CE, RoHS, FCC CE, RoHS, FCC CE, RoHS, FCC CE, RoHS, FCC -
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Western Europe North America, Eastern Europe, Oceania, Mid East, Western Europe, Southeast Asia North America, Eastern Europe, Oceania, Mid East, Western Europe, Southeast Asia North America, Eastern Europe, Oceania, Mid East, Western Europe, Southeast Asia Domestic
      Annual Export Revenue - - - - -
      Business Model ODM ODM, OEM ODM, OEM ODM, OEM ODM
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Application Field: Industrial Control;
      Processor Type: Intel;
      Stratification: HardWare Layer;
      Range of Application: General;
      Type: Embedded Systems;
      Machine Word-Length: 8;
      Instruction Type: RISC;
      CPU: Intel Core I7-8550u;
      Video Card: Intel HD Graphics 4400;
      Warranty(Year): 3-Year;
      Hard Drive Type: SSD+HDD;
      RAM Type: DDR3;
      COM: 6*RS232 COM Port;
      OS: Linux/Win10/Win7;
      Use: Industrial;
      USB Port: 4*USB 3.0 Port+ 2*USB 2.0 Port;
      Storage: 1*Msata+1*2.5 Inch SATA HDD;
      LAN: 2* RJ45 LAN;
      Video Memory: 2 GB;
      RAM: 16GB Max;
      Display: 1*HD+1*VGA;
      Application Field: Industrial Control;
      Processor Type: ARM;
      Stratification: HardWare Layer;
      Range of Application: General;
      Type: System on Module;
      Kernel: PIC;
      Product Type: System on Module Som;
      Processor: Rockchip Rk3576, 8nm, Octa-Core (4xa72 + 4xa53);
      OS: Android 14;
      Npu Computing Power: 6.0 Tops, Int4/Int8/Int16;
      Memory: Lpddr4 4GB/8GB/16GB/32GB;
      Storage: Emmc 64GB/128GB/256GB;
      Expansion: Pcie 3.0, SATA3.0, USB3.1, USB3.0;
      Networking: 2xgigabit Ethernet, WiFi 6, Bt 5.0 (Carrier Board);
      Applications: Ai, Edge Computing, Robotics, Industrial Automatio;
      Audio: Can Be Customized;
      Input Power: The Carrier Board Can Be Customized;
      Customization Services: OS Debugging, Interfaces/Storage/Wireless Custom;
      Environment: Operating Temperature -20°c ~ 60°c;
      Application Field: Industrial Control;
      Processor Type: ARM;
      Stratification: HardWare Layer;
      Range of Application: General;
      Type: System on Module;
      Kernel: PIC;
      Product Type: System on Module Som;
      Processor: Rockchip Rk3588s, Octa Core 2.4GHz 8nm 6tops;
      OS: Android 14;
      Npu Computing Power: 6.0 Tops, Int4/Int8/Int16;
      Memory: Lpddr4 4GB/8GB/16GB/32GB;
      Storage: Emmc 64GB/128GB/256GB;
      Expansion: Pcie 3.0, SATA3.0, USB3.1, USB3.0;
      Networking: 2xgigabit Ethernet, WiFi 6, Bt 5.0 (Carrier Board);
      Applications: Ai, Edge Computing, Robotics, Industrial Automatio;
      Audio: Can Be Customized;
      Input Power: The Carrier Board Can Be Customized;
      Customization Services: OS Debugging, Interfaces/Storage/Wireless Custom;
      Environment: Operating Temperature -20°c ~ 60°c;
      Application Field: Industrial Control;
      Processor Type: ARM;
      Stratification: HardWare Layer;
      Range of Application: General;
      Type: System on Module;
      Kernel: PIC;
      Product Type: System on Module Som;
      Processor: Rockchip Rk3588s, Octa Core 2.4GHz 8nm 6tops;
      OS: Android 14;
      Npu Computing Power: 6.0 Tops, Int4/Int8/Int16;
      Memory: Lpddr4 4GB/8GB/16GB/32GB;
      Storage: Emmc 64GB/128GB/256GB;
      Expansion: Pcie 3.0, SATA3.0, USB3.1, USB3.0;
      Networking: 2xgigabit Ethernet, WiFi 6, Bt 5.0 (Carrier Board);
      Applications: Ai, Edge Computing, Robotics, Industrial Automatio;
      Audio: Can Be Customized;
      Input Power: The Carrier Board Can Be Customized;
      Customization Services: OS Debugging, Interfaces/Storage/Wireless Custom;
      Environment: Operating Temperature -20°c ~ 60°c;
      Application Field: Industrial Control;
      Range of Application: Dedicated;
      Type: Embedded Board;
      Machine Word-Length: 32;
      Interface Type: PCI Express 2.0 16X;
      MOQ: 1;
      Supplier Name

      Shenzhen Fannis Technology Co., Ltd

      Diamond Member Audited Supplier

      Shenzhen Pretech Industrial Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Pretech Industrial Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Pretech Industrial Co., Ltd.

      Diamond Member Audited Supplier

      Telefly Telecommunications Equipment Co., Ltd.

      Diamond Member Audited Supplier