Mini PC

US$179.40-206.53 / units

Hystou High Speed Fanless Windows10/11 Linux Intel Core I5 10th Gen Desktop Computer 2*RJ45 LAN DDR4 Industrial Mini Powerful PC pictures & photos

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What is Hystou High Speed Fanless Windows10/11 Linux Intel Core I5 10th Gen Desktop Computer 2*RJ45 LAN DDR4 Industrial Mini Powerful PC

Name: Hystou High Speed Fanless Windows10/11 Linux Intel Core I5 10th Gen Desktop Computer 2*RJ45 LAN DDR4 Industrial Mini Powerful PC
Uploaded: 2026-03-31T16:07:08+08:00
Description: Product Picture HYSTOU Fanless Industrial Mini PC Core i3 i5 i7 Rich interfaces to respond to the needs Fanless Industrial PC H6 is equipped with 6*USB, 2*COM, 2*LAN, 1*DP, 2*HD interfaces, etc. U

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Price

Purchase Qty. Reference FOB Price

1-9 units US$206.53

10-99 units US$204.68

100+ units US$179.40

Sepcifications

Application Field Industrial Control
Processor Type Intel
Stratification HardWare Layer
Range of Application General
Bus Type Not Bus Type
Certification CE, RoHS, FCC
Type Embedded Systems
Machine Word-Length 8
Instruction Type RISC
Kernel PIC
Transport Package Standard Color Express Box
Specification PC size 205*125*53mm Package size 308*206*75mm
Trademark HYSTOU
Origin Guangdong, China
CPU Intel Core I5-101210u
GPU Intel UHD Graphics
Hard Drive Type SSD+HDD
RAM Type DDR4
LAN 2*RJ45 LAN
USB Port 2*USB 2.0 Port, 4*USB 3.0 Port
OS Windows 10/11, Linux
Plugs Type Us, Jp, Cn, Au, UK, EU
Material Aluminum Alloy
Graphics Card Chipset Integrated Card
Use Industrial
Warranty(Year) 3-Year
Video Memory 2 GB
Weight Net 1.2kg; Gross 1.9kg

Product Description

Product Picture HYSTOU Fanless Industrial Mini PC Core i3 i5 i7 Rich interfaces to respond to the needs Fanless Industrial PC H6 is equipped with 6*USB, 2*COM, 2*LAN, 1*DP, 2*HD interfaces, etc. USB3.0 transmission speed is fast, which improves your work efficiency and saves your time. It ...

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Shenzhen Fannis Technology Co., Ltd

Diamond Member Since 2024

Audited Supplier

Rating & Reviews: 5.0/5.0

(12 Reviews)

Main Products Mini PC, Fanless Computer, Industrial PC, All in One PC, Touch Screen Industrial Panel PC, ...
Address 10th Floor, Building a, Sanhuan Technology Building, No. 1, Dongchang Road and Tongren Road, Guangming District, Shenzhen City, Guangdong Province, Shenzhen, Guangdong, China
Main Markets North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Western Europe
International Commercial Terms(Incoterms) FOB, EXW, CIF, DDP, DAP, FCA
Terms of Payment LC, T/T, PayPal, Western Union, Money Gram, Visa Card
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Mini PC Comparison

	Hystou High Speed Fanless Windows10/11 Linux Intel Core I5 10th Gen Desktop Computer 2*RJ45 LAN DDR4 Industrial Mini Powerful PC Contact Now	Quick View Som Rk3566 Linux Android WiFi 6 Bluetooth5.0 0.8 Tops Npu Mipi Edp Lvds USB3.0 USB2.0 for Customization Contact Now	Quick View Rk3588s Board 8 Core 64bits 8nm Single Board Computer Android Development Board Contact Now	Quick View Rk3588 PCB Manufacturing and Assembly 6tops Computingpower Circuit Board Android Development Board Contact Now	Quick View Rk 3588 Android OEM Board Aiot Embedded System Development Board Contact Now

Transaction Info
	Hystou High Speed Fanless Windows10/11 Linux Intel Core I5 10th Gen Desktop Computer 2*RJ45 LAN DDR4 Industrial Mini Powerful PC Contact Now	Quick View Som Rk3566 Linux Android WiFi 6 Bluetooth5.0 0.8 Tops Npu Mipi Edp Lvds USB3.0 USB2.0 for Customization Contact Now	Quick View Rk3588s Board 8 Core 64bits 8nm Single Board Computer Android Development Board Contact Now	Quick View Rk3588 PCB Manufacturing and Assembly 6tops Computingpower Circuit Board Android Development Board Contact Now	Quick View Rk 3588 Android OEM Board Aiot Embedded System Development Board Contact Now
Price	US$179.40-206.53 / units	US$28.00-50.00 / Piece	US$117.00-156.00 / Piece	US$121.00-160.00 / Piece	US$85.00-112.00 / Piece
Min Order	1 units	2 Pieces	2 Pieces	2 Pieces	2 Pieces
Payment Terms	LC, T/T, PayPal, Western Union, Money Gram, Visa Card	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, D/P, PayPal, Western Union, Small-amount payment
Quality Control
Product Certification	CE, RoHS, FCC	CE, RoHS, FCC	CE, RoHS, FCC	CE, RoHS, FCC	CE, RoHS, FCC
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Western Europe	North America, Eastern Europe, Oceania, Mid East, Western Europe, Southeast Asia	North America, Eastern Europe, Oceania, Mid East, Western Europe, Southeast Asia	North America, Eastern Europe, Oceania, Mid East, Western Europe, Southeast Asia	North America, Eastern Europe, Oceania, Mid East, Western Europe, Southeast Asia
Annual Export Revenue	-	-	-	-	-
Business Model	ODM	ODM, OEM	ODM, OEM	ODM, OEM	ODM, OEM
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Application Field: Industrial Control; Processor Type: Intel; Stratification: HardWare Layer; Range of Application: General; Bus Type: Not Bus Type; Type: Embedded Systems; Machine Word-Length: 8; Instruction Type: RISC; Kernel: PIC; CPU: Intel Core I5-101210u; GPU: Intel UHD Graphics; Hard Drive Type: SSD+HDD; RAM Type: DDR4; LAN: 2RJ45 LAN;* USB Port: 2USB 2.0 Port, 4USB 3.0 Port; OS: Windows 10/11, Linux; Plugs Type: Us, Jp, Cn, Au, UK, EU; Material: Aluminum Alloy; Graphics Card Chipset: Integrated Card; Use: Industrial; Warranty(Year): 3-Year; Video Memory: 2 GB; Weight: Net 1.2kg; Gross 1.9kg;	Application Field: Industrial Control; Processor Type: ARM; Stratification: HardWare Layer; Range of Application: General; Type: System on Module; Kernel: PIC; Product Name: Rk3566 Som;	Application Field: Industrial Control; Processor Type: ARM; Stratification: HardWare Layer; Range of Application: General; Type: System on Module; Kernel: PIC; Product Type: System on Module Som; Processor: Rockchip Rk3588s, 8nm, Octa-Core (4xa76 + 4xa55); OS: Android 13 Debian 11.6; GPU: Mali-G610 MP4, 450 Gflops; Npu Computing Power: 6.0 Tops, Int4/Int8/Int16; Memory: Lpddr4 4GB/8GB/16GB/32GB; Storage: Emmc 64GB/128GB/256GB; Video Decode: 8K@60fps H.265/Vp9, 8K@30fps H.264, 4K AV1; Expansion: Pcie 3.0, SATA3.0, USB3.1, USB3.0; Networking: 2xgigabit Ethernet, WiFi 6, Bt 5.0 (Carrier Board); Applications: Ai, Edge Computing, Robotics, Industrial Automatio; Audio: Can Be Customized; Input Power: The Carrier Board Can Be Customized; Customization Services: OS Debugging, Interfaces/Storage/Wireless Custom; Environment: Operating Temperature -20°c ~ 60°c;	Application Field: Industrial Control; Processor Type: ARM; Stratification: HardWare Layer; Range of Application: General; Type: System on Module; Kernel: PIC; Product Type: System on Module Som+ Carrier Board; Processor: Rockchip Rk3588s, 8nm, Octa-Core (4xa76 + 4xa55); OS: Android 13 Debian 11.6; GPU: Mali-G610 MP4, 450 Gflops; Npu Computing Power: 6.0 Tops, Int4/Int8/Int16; Memory: Lpddr4 4GB/8GB/16GB/32GB; Storage: Emmc 64GB/128GB/256GB; Video Decode: 8K@60fps H.265/Vp9, 8K@30fps H.264, 4K AV1; Expansion: Pcie 3.0, SATA3.0, USB3.1, USB3.0; Networking: 2xgigabit Ethernet, WiFi 6, Bt 5.0 (Carrier Board); Applications: Ai, Edge Computing, Robotics, Industrial Automatio; Audio: Can Be Customized; Input Power: The Carrier Board Can Be Customized; Customization Services: OS Debugging, Interfaces/Storage/Wireless Custom; Environment: Operating Temperature -20°c ~ 60°c;	Application Field: Industrial Control; Processor Type: ARM; Stratification: HardWare Layer; Range of Application: General; Type: System on Module; Kernel: PIC; Product Type: System on Module Som+ Carrier Board; Processor: Rockchip Rk3588s, 8nm, Octa-Core (4xa76 + 4xa55); OS: Android 13 Debian 11.6; GPU: Mali-G610 MP4, 450 Gflops; Npu Computing Power: 6.0 Tops, Int4/Int8/Int16; Memory: Lpddr4 4GB/8GB/16GB/32GB; Storage: Emmc 64GB/128GB/256GB; Video Decode: 8K@60fps H.265/Vp9, 8K@30fps H.264, 4K AV1; Expansion: Pcie 3.0, SATA3.0, USB3.1, USB3.0; Networking: 2xgigabit Ethernet, WiFi 6, Bt 5.0 (Carrier Board); Applications: Ai, Edge Computing, Robotics, Industrial Automatio; Audio: Can Be Customized; Input Power: The Carrier Board Can Be Customized; Customization Services: OS Debugging, Interfaces/Storage/Wireless Custom; Environment: Operating Temperature -20°c ~ 60°c;
Supplier Name	Shenzhen Fannis Technology Co., Ltd	Shenzhen Pretech Industrial Co., Ltd.	Shenzhen Pretech Industrial Co., Ltd.	Shenzhen Pretech Industrial Co., Ltd.	Shenzhen Pretech Industrial Co., Ltd.
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