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      What is Precision Engineering Wafer Back Grinding Machine for Customization

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      1 Piece Negotiable

      Sepcifications

      • After-sales Service Provided
      • Function High Temperature Resistance
      • Demoulding Automatic
      • Condition New
      • Certification RoHS, ISO, CE
      • Warranty 12 Months
      • Automatic Grade Automatic
      • Installation Desktop
      • Driven Type Electric
      • Mould Life >1,000,000 Shots
      • Transport Package Customized or Wooden Box Packaging
      • Specification Standard Specifications
      • Trademark Himalaya
      • Origin China
      • Product Name Wafer Back Grinding Equipment
      • Feature 1 High Precision
      • Feature 2 High Efficiency
      • OEM/ODM Service Provided

      Product Description

      Customized Ultra-Precision Wafer Back Grinding Machine Product Description Equipment Advantage Equipped with material information scanning and input system Equipped wtith wafer level handling robot Equipped with Fool-proofing system to identify the positive and negative side of the wafer ...

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      Advanced Machine Comparison
      Transaction Info
      Price Negotiable US$860.00 / Set US$3,000.00-4,000.00 / set US$2,480.00-2,590.00 / set US$5,000.00-8,000.00 / Set
      Min Order 1 Piece 1 Set 1 set 1 set 1 Set
      Payment Terms LC, T/T, PayPal, Western Union T/T, PayPal, Small-amount payment T/T, PayPal, Small-amount payment T/T, PayPal, Small-amount payment T/T, PayPal, Small-amount payment
      Quality Control
      Product Certification RoHS, ISO, CE CCC CE CE -
      Management System Certification - - - - -
      Trade Capacity
      Export Markets Europe North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea)
      Annual Export Revenue - - - - -
      Business Model ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM
      Average Lead Time Peak Season Lead Time: 3-6 months
      Off Season Lead Time: 1-3 months
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      After-sales Service: Provided;
      Function: High Temperature Resistance;
      Demoulding: Automatic;
      Condition: New;
      Warranty: 12 Months;
      Automatic Grade: Automatic;
      Installation: Desktop;
      Driven Type: Electric;
      Mould Life: >1,000,000 Shots;
      Product Name: Wafer Back Grinding Equipment;
      Feature 1: High Precision;
      Feature 2: High Efficiency;
      OEM/ODM Service: Provided;
      Condition: New;
      Warranty: 12 Months;
      Automatic Grade: Automatic;
      Driven Type: Electric;
      Model: Sr-9050s;
      Winding Plate Diameter: 200mm;
      Winding Shape: Circle Shape, 8-Shaped;
      Binding Diameter: 18-45mm;
      Cable Tie Length: 50-200mm;
      Tying Speed: Adjustable;
      Voltage: AC220V,50Hz/60Hz;
      Power: 400W;
      Condition: New;
      Warranty: 12 Months;
      Automatic Grade: Semiautomatic;
      Driven Type: Electric;
      Control System: PLC, Touch Screen;
      Cutting Method: Rotary Cutting;
      Moter: 400W Servo Cutting Motor;
      Blade Stroke: 8mm;
      Cutting Tube Diameter: 5-42mm;
      Length Error: ±0.01*Length;
      Speed: 10-60/Min;
      Voltage: AC220V 50/60Hz;
      Power: 750W;
      Condition: New;
      Warranty: 12 Months;
      Automatic Grade: Semiautomatic;
      Driven Type: Electric;
      Model: Sr-6321;
      Binding Width: 20/30mm (Support to Customize The Width Size);
      Packing Tape: Paper Tape or OPP Tape;
      Binding Force: 5-60n(If Need Bigger Force, Support to Customize);
      Minimun Packing Size: W40*H10mm;
      Maximum Packing Size: W410*H200mm;
      Material Roll Size: Tape ID: 76mm, Tape Od: 340mm;
      Machine Dimensions(L*W*H): 570*1105*430mm;
      Function: Inserting Waterproof Seal to Wire;
      Condition: New;
      Warranty: 12 Months;
      Automatic Grade: Semiautomatic;
      Installation: Desktop;
      Driven Type: Electric;
      Weight: 45kg;
      Voltage: AC220V 50/60Hz;
      Motor Power: 24VDC-50W;
      Applicable Wire Seal: Max D13*L14 Customized According to Customers;
      Air Source: 0.5-0.6MPa;
      Efficiency: 60/Min;
      Supplier Name

      Jiangsu Himalaya Semiconductor Co., Ltd.

      Gold Member Audited Supplier

      Sinrad Technology Co., Ltd.

      Gold Member Audited Supplier

      Sinrad Technology Co., Ltd.

      Gold Member Audited Supplier

      Sinrad Technology Co., Ltd.

      Gold Member Audited Supplier

      Sinrad Technology Co., Ltd.

      Gold Member Audited Supplier