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      Design PCB Fabrication PCBA for Aerospace Navigation Systems with High-Frequency PCB Assembly

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      1 Piece US$0.30-1.00 / Piece

      Sepcifications

      • Metal Coating Copper
      • Mode of Production DIP
      • Layers Multilayer
      • Base Material FR-4
      • Certification RoHS, ISO
      • Customized Customized
      • Condition New
      • Transport Package Box
      • Trademark hemeixin
      • Origin China
      • Type Rigid Circuit Board
      • Dielectric Fr-4
      • Material Fiberglass Epoxy
      • Application Consumer Electronics
      • Flame Retardant Properties V0
      • Mechanical Rigid Rigid
      • Insulation Materials Epoxy Resin
      • Processing Technology Immersion Gold
      • Copper Thickness 3oz -105oz
      • Surface Finish Gold Finger
      • Special Technology Metal Edging
      • Special 1 Blind Hole
      • Special 2 Buried Vias
      • Special 3 Flex-Rigid PCB
      • Surface Finish 1 Immersion Gold Immersion Tin Hal Lead Free

      Product Description

      Product Description This PCB are 6mm thickness Metal edging Copper thickness is 8oz Our advantages 1)Thickness copper PCB Max Single side PCB copper thickness is 8.0mm/0.035=228oz (Quantity produces) Max Double side pcb copper thickness is 3.0mm/0.035=85oz (Quantity produces) 2) ...

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      PCB Assembly Comparison
      Transaction Info
      Price US$0.30-1.00 / Piece US$1.88 / Piece Negotiable Negotiable US$1.88 / Piece
      Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
      Payment Terms T/T, PayPal, Western Union, Small-amount payment T/T LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T
      Quality Control
      Product Certification RoHS, ISO ISO 13485 RoHS, CCC RoHS, CCC ISO 13485
      Management System Certification - - - - -
      Trade Capacity
      Export Markets South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe North America, Europe North America, Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe
      Annual Export Revenue - - - - -
      Business Model - - ODM, OEM ODM, OEM -
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Product Attributes
      Specification
      Metal Coating: Copper;
      Mode of Production: DIP;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      Type: Rigid Circuit Board;
      Dielectric: Fr-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Insulation Materials: Epoxy Resin;
      Processing Technology: Immersion Gold;
      Copper Thickness: 3oz -105oz;
      Surface Finish: Gold Finger;
      Special Technology: Metal Edging;
      Special 1: Blind Hole;
      Special 2: Buried Vias;
      Special 3: Flex-Rigid PCB;
      Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
      Metal Coating: Gold;
      Mode of Production: SMT;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      Production Time: Within 4 Weeks;
      Copper Thickness: 1-4oz;
      Keywords: Multilayer Electronic Circuit Board;
      Metal Coating: Tin;
      Mode of Production: SMT;
      Layers: Single-Layer;
      Base Material: PCB;
      Customized: Non-Customized;
      Condition: New;
      Processor: Broadcom Bcm2837b0;
      Memory: 1GB;
      Environment: Operating Temperature 0–50℃;
      Access: 40-Pin Gpio Header;
      Wireless/Bluetooth: Yes;
      Metal Coating: Tin;
      Mode of Production: SMT;
      Layers: Single-Layer;
      Base Material: PCB;
      Customized: Non-Customized;
      Condition: New;
      Processor: Broadcom Bcm2837b0;
      Memory: 1GB;
      Environment: Operating Temperature 0–50℃;
      Access: 40-Pin Gpio Header;
      Wireless/Bluetooth: Yes;
      Metal Coating: Gold;
      Mode of Production: SMT;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      Production Time: Within 4 Weeks;
      Copper Thickness: 1-4oz;
      Keywords: Multilayer Electronic Circuit Board;
      Supplier Name

      Shenzhen Hemeixin Electronic Co., Limited

      Gold Member Audited Supplier

      Shenzhen Grandtop Electronics Co., Ltd.

      Diamond Member Audited Supplier

      CENTURY SOLUTIONS LIMITED

      Gold Member Audited Supplier

      CENTURY SOLUTIONS LIMITED

      Gold Member Audited Supplier

      Shenzhen Grandtop Electronics Co., Ltd.

      Diamond Member Audited Supplier