| Specification |
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: Fr4;
Customized: Customized;
Condition: New;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Teck: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Fr4 Fr1 Cem1 Fr2;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: DIP;
Conductive Type: Bipolar Integrated Circuit;
Integration: Gsi;
Technics: Semiconductor IC;
D/C: Standard;
Warranty: 2 Years;
Mounting Type: Standard, SMT, DIP;
Cross Reference: Standard;
Memory Type: Standard;
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Mode of Production: DIP;
Layers: Double-Layer;
Customized: Non-Customized;
Condition: New;
Video Input: PAL/SDI;
Video Output: HDMI/SDI;
ROM: 128gbyte Emmc;
RAM: 8gbyte Lpddr4X;
Voltage: DC 12V;
Ai Feature: Detection and Recognition;
Image Enhancement: Stabilisation, Fusion, Stitching, Defog;
Operating Temperature: -40℃+60℃;
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Mode of Production: DIP;
Layers: Double-Layer;
Customized: Non-Customized;
Condition: New;
Video Input: PAL/SDI;
Video Output: HDMI/SDI;
ROM: 128gbyte Emmc;
RAM: 8gbyte Lpddr4X;
Voltage: DC 12V;
Ai Feature: Detection and Recognition;
Image Enhancement: Stabilisation, Fusion, Stitching, Defog;
Operating Temperature: -40℃+60℃;
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Mode of Production: DIP;
Layers: Double-Layer;
Customized: Non-Customized;
Condition: New;
Video Input: PAL/SDI;
Video Output: HDMI/SDI;
ROM: 128gbyte Emmc;
RAM: 8gbyte Lpddr4X;
Voltage: DC 12V;
Ai Feature: Detection and Recognition;
Image Enhancement: Stabilisation, Fusion, Stitching, Defog;
Operating Temperature: -40℃+60℃;
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