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      Motherboard PCBA
      US$0.10-1.00 / Piece

      Two-Way Mobile Power Bank 5-Port 22.5W Power Bank Module Fast Charging Assembly Factory Board Electronics PCB Video

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      1 Piece US$0.10-1.00 / Piece

      Sepcifications

      • Metal Coating Gold
      • Mode of Production SMT
      • Layers Double-Layer
      • Base Material Fr4
      • Certification RoHS, ISO
      • Customized Customized
      • Condition New
      • Transport Package Box
      • Trademark hemeixin
      • Origin China
      • Copper Thickness 3oz -105oz
      • Surface Finish Gold Finger
      • Special Teck Metal Edging
      • Special 1 Blind Hole
      • Special 2 Buried Vias
      • Special 3 Fr4 Fr1 Cem1 Fr2

      Product Description

      Product Description This PCB are 6mm thickness Metal edging Copper thickness is 8oz Our advantages 1)Thickness copper PCB Max Single side PCB copper thickness is 8.0mm/0.035=228oz (Quantity produces) Max Double side pcb copper thickness is 3.0mm/0.035=85oz (Quantity produces) 2) ...

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      Motherboard PCBA Comparison
      Transaction Info
      Price US$0.10-1.00 / Piece US$0.50-1.00 / Piece Negotiable Negotiable Negotiable
      Min Order 1 Piece 10 Pieces 2 Pieces 2 Pieces 2 Pieces
      Payment Terms T/T, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T T/T T/T
      Quality Control
      Product Certification RoHS, ISO RoHS, CCC, ISO CE CE CE
      Management System Certification - - - - -
      Trade Capacity
      Export Markets South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) Domestic Domestic Domestic
      Annual Export Revenue - - - - -
      Business Model - - Own Brand, ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Metal Coating: Gold;
      Mode of Production: SMT;
      Layers: Double-Layer;
      Base Material: Fr4;
      Customized: Customized;
      Condition: New;
      Copper Thickness: 3oz -105oz;
      Surface Finish: Gold Finger;
      Special Teck: Metal Edging;
      Special 1: Blind Hole;
      Special 2: Buried Vias;
      Special 3: Fr4 Fr1 Cem1 Fr2;
      Metal Coating: Copper;
      Mode of Production: SMT;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      Shape: DIP;
      Conductive Type: Bipolar Integrated Circuit;
      Integration: Gsi;
      Technics: Semiconductor IC;
      D/C: Standard;
      Warranty: 2 Years;
      Mounting Type: Standard, SMT, DIP;
      Cross Reference: Standard;
      Memory Type: Standard;
      Mode of Production: DIP;
      Layers: Double-Layer;
      Customized: Non-Customized;
      Condition: New;
      Video Input: PAL/SDI;
      Video Output: HDMI/SDI;
      ROM: 128gbyte Emmc;
      RAM: 8gbyte Lpddr4X;
      Voltage: DC 12V;
      Ai Feature: Detection and Recognition;
      Image Enhancement: Stabilisation, Fusion, Stitching, Defog;
      Operating Temperature: -40℃+60℃;
      Mode of Production: DIP;
      Layers: Double-Layer;
      Customized: Non-Customized;
      Condition: New;
      Video Input: PAL/SDI;
      Video Output: HDMI/SDI;
      ROM: 128gbyte Emmc;
      RAM: 8gbyte Lpddr4X;
      Voltage: DC 12V;
      Ai Feature: Detection and Recognition;
      Image Enhancement: Stabilisation, Fusion, Stitching, Defog;
      Operating Temperature: -40℃+60℃;
      Mode of Production: DIP;
      Layers: Double-Layer;
      Customized: Non-Customized;
      Condition: New;
      Video Input: PAL/SDI;
      Video Output: HDMI/SDI;
      ROM: 128gbyte Emmc;
      RAM: 8gbyte Lpddr4X;
      Voltage: DC 12V;
      Ai Feature: Detection and Recognition;
      Image Enhancement: Stabilisation, Fusion, Stitching, Defog;
      Operating Temperature: -40℃+60℃;
      Supplier Name

      Shenzhen Hemeixin Electronic Co., Limited

      Gold Member Audited Supplier

      Mu Star (shenzhen) Industry Co., Ltd.

      Diamond Member Audited Supplier

      Xi'an Zhongke Lead IR-Tech Co., Ltd.

      Gold Member Audited Supplier

      Xi'an Zhongke Lead IR-Tech Co., Ltd.

      Gold Member Audited Supplier

      Xi'an Zhongke Lead IR-Tech Co., Ltd.

      Gold Member Audited Supplier