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      PCBA PCB Assembly
      US$170.00-215.00 / Set
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      What is Customized PCB PCBA Inverter Heat Pump Controller Printed Circuit Board PCB Assembly PCBA

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      2 Sets US$170.00-215.00 / Set

      Sepcifications

      • Metal Coating Copper
      • Mode of Production SMT
      • Layers Double-Layer
      • Base Material FR-4
      • Certification RoHS, ISO
      • Customized Customized
      • Condition New
      • Transport Package 1.Protect Product with Polyfoam and Multi Layer PA
      • Specification Mounting size: 267*200*125mm
      • Trademark ELECHICO
      • Origin Foshan, China
      • Produuct Name Inverter Heat Pump Controller
      • Application Commercial Heat Pump Machine
      • Power Supply 220&Plusmn, 50/60Hz
      • Sensor Type Ntc(5K, 50K)
      • Controlling Range -20°C~60°C
      • Control Mode Heating,Cooling, Hot Water
      • Max Input Power 3.5-4.5kw
      • Max Input Current 16-21A
      • Inverter Frequency Range 15Hz-120Hz
      • Carrier Frequency 5kHz
      • Pfc Valve 0.90-0.99

      Product Description

      Product Description CCHW008 Multifunctional Hot Water Heating Cooling DC Inverter Heat Pump Controller PCBA CCHW008 Series Multifunctional Inverter heat pump controller is designed for controlling commercial heating or cooling heat pump with DC inverter compressor driver control board. Inverter ...

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      PCBA PCB Assembly Comparison
      Transaction Info
      Price US$170.00-215.00 / Set US$1.68-5.82 / Piece US$0.76-5.00 / Piece US$0.80-8.00 / Piece US$1.00-50.00 / Piece
      Min Order 2 Sets 10 Pieces 10 Pieces 10 Pieces 1 Piece
      Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T T/T T/T T/T
      Quality Control
      Product Certification RoHS, ISO RoHS, CCC, ISO RoHS, ISO RoHS, ISO RoHS, ISO
      Management System Certification - ISO9001:2015 ISO9001:2015 ISO9001:2015 ISO9001:2015
      Trade Capacity
      Export Markets North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic Domestic Domestic Domestic Domestic
      Annual Export Revenue - - - - -
      Business Model Own Brand, ODM, OEM ODM, OEM ODM, OEM ODM, OEM ODM, OEM
      Average Lead Time Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Product Attributes
      Specification
      Metal Coating: Copper;
      Mode of Production: SMT;
      Layers: Double-Layer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      Produuct Name: Inverter Heat Pump Controller;
      Application: Commercial Heat Pump Machine;
      Power Supply: 220&Plusmn, 50/60Hz;
      Sensor Type: Ntc(5K, 50K);
      Controlling Range: -20°C~60°C;
      Control Mode: Heating,Cooling, Hot Water;
      Max Input Power: 3.5-4.5kw;
      Max Input Current: 16-21A;
      Inverter Frequency Range: 15Hz-120Hz;
      Carrier Frequency: 5kHz;
      Pfc Valve: 0.90-0.99;
      Metal Coating: Copper;
      Mode of Production: SMT;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      PCBA-Testing: X-ray, Aoi;
      Processing: Electrolytic Foil;
      SMT Capacity: >2 Million Points/Day;
      DIP Capacity: >100K Parts/Day;
      Min. Space of BGA: +/- 0.3mm;
      Min.Pin Space of IC: 0.3mm;
      Max.Precision of IC Assembly: 0.03mm;
      Surface Finishing: Lead-Free HASL;
      Number of Layers: 4-10 Layer;
      Board Thickness: 1.6mm;
      Metal Coating: Copper;
      Mode of Production: SMT;
      Layers: Multilayer;
      Base Material: FR-6;
      Customized: Customized;
      Condition: New;
      PCBA-Testing: X-ray, Aoi;
      Processing: Electrolytic Foil;
      SMT Capacity: >2 Million Points/Day;
      DIP Capacity: >100K Parts/Day;
      Min. Space of BGA: +/- 0.3mm;
      Min.Pin Space of IC: 0.3mm;
      Max.Precision of IC Assembly: 0.03mm;
      Surface Finishing: Lead-Free HASL;
      Number of Layers: 4-10 Layer;
      Board Thickness: 1.6mm;
      Metal Coating: Copper;
      Mode of Production: SMT;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      PCBA-Testing: X-ray, Aoi;
      Processing: Electrolytic Foil;
      SMT Capacity: >2 Million Points/Day;
      DIP Capacity: >100K Parts/Day;
      Min. Space of BGA: +/- 0.3mm;
      Min.Pin Space of IC: 0.3mm;
      Max.Precision of IC Assembly: 0.03mm;
      Surface Finishing: Lead-Free HASL;
      Number of Layers: 4-10 Layer;
      Board Thickness: 1.6mm;
      Metal Coating: Copper;
      Mode of Production: SMT;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      Model No.: 0563;
      PCBA-Testing: X-ray, Aoi;
      Small Order: Acceptable;
      Type: Rigid Circuit Board;
      Flame Retardant: V0;
      Processing Technology: Electrolytic Foil;
      Insulation Materials: Organic Resin;
      Material: Complex;
      Supplier Name

      Guangdong Chico Future Technology Group Inc.

      Diamond Member Audited Supplier

      Shenzhen Hongzhou Smart Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Hongzhou Smart Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Hongzhou Smart Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Hongzhou Smart Technology Co., Ltd.

      Diamond Member Audited Supplier