$Enig Intermetallic Compound (IMC) Growth in-Situ Monitoring PCB Using Real-Time X-ray Diffraction During Thermal Aging to Control Formation pictures & photos$

$Enig Intermetallic Compound (IMC) Growth in-Situ Monitoring PCB Using Real-Time X-ray Diffraction During Thermal Aging to Control Formation$
$Enig Intermetallic Compound (IMC) Growth in-Situ Monitoring PCB Using Real-Time X-ray Diffraction During Thermal Aging to Control Formation$
$Enig Intermetallic Compound (IMC) Growth in-Situ Monitoring PCB Using Real-Time X-ray Diffraction During Thermal Aging to Control Formation$
$Enig Intermetallic Compound (IMC) Growth in-Situ Monitoring PCB Using Real-Time X-ray Diffraction During Thermal Aging to Control Formation$
$Enig Intermetallic Compound (IMC) Growth in-Situ Monitoring PCB Using Real-Time X-ray Diffraction During Thermal Aging to Control Formation$
$Enig Intermetallic Compound (IMC) Growth in-Situ Monitoring PCB Using Real-Time X-ray Diffraction During Thermal Aging to Control Formation$

Enig Intermetallic Compound (IMC) Growth in-Situ Monitoring PCB Using Real-Time X-ray Diffraction During Thermal Aging to Control Formation

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Price

Min. Order Reference FOB Price

1 Piece US$0.82-2.05 / Piece

Sepcifications

Dielectric FR-4
Transport Package Vacuum+Carton Packing
Specification RoHS, ISO9001, UL, SGS
Trademark FL
Origin Shenzhen, China
Board Material Fr4
Board Layer 4
Board Thickness 1.6mm
Copper Thickness 2 Oz
Max PCB Size 650*650mm
Min Hole 0.1mm
Min Trace 0.15mm
Surface Finishing Enig
Solder Mask Any
Lead Time 4-5 Working Days
Test 100%
Service One-Stop
Packaging Vacuum + Carton
Certificate RoHS UL
Payment T/T,Paypal,Western Union

Product Description

Shenzhen Factory Manufacturing Rigid Flexible PCB Circuit Board Hi buyer, Thank your for scanning our Rigid-Flex PCB Products. As is known,PCB is customized product ,so the unit price is not real,details pls contact me and a quotation will be offered.Please send us PCB files in gerber ...

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Fastline Circuits Co., Limited

Diamond Member Since 2013

Audited Supplier

Main Products Print Circuit Board, Aluminum PCB, Flexible PCB, Rigid PCB, PCB Prototype, PCB Assembly, ...
Year of Establishment 2006-09-21
Address 3/F, Building B3, Fuqiao No. 4, Fuhai Subdistrict, Baoan District, Shenzhen, Guangdong, China
Plant Area 580 square meters
Registered Capital 1,000,000 RMB
Main Markets North America, South America, Europe, Southeast Asia/ Mideast

Enig Intermetallic Compound Comparison

	$Enig Intermetallic Compound (IMC) Growth in-Situ Monitoring PCB Using Real-Time X-ray Diffraction During Thermal Aging to Control Formation$ Enig Intermetallic Compound (IMC) Growth in-Situ Monitoring PCB Using Real-Time X-ray Diffraction During Thermal Aging to Control Formation Contact Now	Quick View Ross Hill PC03 Single Row Diode Board Contact Now	Quick View Piezoelectric Ceramic Components Plate For Ultrasonic Transducer Applications Contact Now	Quick View Semiconductor Ceramic Packages Electronic Ceramic Plate For High Frequency Device Protection Contact Now	Quick View Functional Electronic Ceramics Plate With Customized Electrical Properties Contact Now

Transaction Info
	$Enig Intermetallic Compound (IMC) Growth in-Situ Monitoring PCB Using Real-Time X-ray Diffraction During Thermal Aging to Control Formation$ Enig Intermetallic Compound (IMC) Growth in-Situ Monitoring PCB Using Real-Time X-ray Diffraction During Thermal Aging to Control Formation Contact Now	Quick View Ross Hill PC03 Single Row Diode Board Contact Now	Quick View Piezoelectric Ceramic Components Plate For Ultrasonic Transducer Applications Contact Now	Quick View Semiconductor Ceramic Packages Electronic Ceramic Plate For High Frequency Device Protection Contact Now	Quick View Functional Electronic Ceramics Plate With Customized Electrical Properties Contact Now
Price	US$0.82-2.05 / Piece	US$200.00-1,000.00 / Piece	US$20.00 / Piece	US$20.00 / Piece	US$20.00 / Piece
Min Order	1 Piece	10 Pieces	1 Piece	1 Piece	1 Piece
Payment Terms	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, PayPal, Western Union	LC, T/T, PayPal	LC, T/T, PayPal	LC, T/T, PayPal
Quality Control
Product Certification	RoHS UL	-	-	-	-
Management System Certification	-	ISO9001:2015, ISO45001:2018, ISO14001, ISO50001	-	-	-
Trade Capacity
Export Markets	North America, South America, Europe, Southeast Asia/ Mideast	Europe, South Asia	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea)	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea)	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea)
Annual Export Revenue	-	-	-	-	-
Business Model	-	ODM, OEM	ODM, OEM	ODM, OEM	ODM, OEM
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: one month	Peak Season Lead Time: within 15 workdays, one month, 1-3 months Off Season Lead Time: within 15 workdays, one month, 1-3 months	Peak Season Lead Time: within 15 workdays, one month, 1-3 months Off Season Lead Time: within 15 workdays, one month, 1-3 months	Peak Season Lead Time: within 15 workdays, one month, 1-3 months Off Season Lead Time: within 15 workdays, one month, 1-3 months
Product Attributes
Specification	Dielectric: FR-4; Board Material: Fr4; Board Layer: 4; Board Thickness: 1.6mm; Copper Thickness: 2 Oz; Max PCB Size: 650650mm;* Min Hole: 0.1mm; Min Trace: 0.15mm; Surface Finishing: Enig; Solder Mask: Any; Lead Time: 4-5 Working Days; Test: 100%; Service: One-Stop; Packaging: Vacuum + Carton; Payment: T/T,Paypal,Western Union;	Dielectric: SIC; Application: Electric Control System; Material: Aluminum; Insulation Material: Organic Resin; Layers: Multilayer;	Dielectric: Aln , Ausn, Ni, Cu; Material: Alumina Nitride; Metal Material: Au, Sn, Ni, Cu and So on; Package: Plastic Box; Thermal Conductivity: High; Encapsulation: CPU/GPU;	Dielectric: Aln , Ausn, Ni, Cu; Material: Alumina Nitride; Metal Material: Au, Sn, Ni, Cu and So on; Package: Plastic Box; Thermal Conductivity: High; Encapsulation: CPU/GPU;	Dielectric: Aln , Ausn, Ni, Cu; Material: Alumina Nitride; Metal Material: Au, Sn, Ni, Cu and So on; Package: Plastic Box; Thermal Conductivity: High; Encapsulation: CPU/GPU;
Supplier Name	Fastline Circuits Co., Limited	Shandong Hande Automation Control Equipment Co., Ltd.	Adena Ceramics International LLC (Shanghai)	Adena Ceramics International LLC (Shanghai)	Adena Ceramics International LLC (Shanghai)
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