国内精品久久人妻无码网站,亚洲视频在线观看免费视频,国产亚洲欧美另类一区二区三区,成人福利国产一区二区,亚洲人成18禁网站,日韩在线精品人妻,都市激情 在线 亚洲 国产,综合欧美日韩一区二区三区
      BGA PCB
      US$0.16-0.26 / Piece
      • Recommend for you
      • What is High Performance Electronic PCB Manufacturer Custome Rigid HDI PCB Circuit Board
      • What is OEM/ODM Fr4 Multilayer PCB Board HASL Surface Finished RoHS/UL Certified PCB Board for Medical Device & Communication Equipment
      • What is Lower Costs Prototype Multilayer PCB Board

      What is BGA Multilayer PCB Circuit Board with High Precision, Long-Term Support Service

      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      1-999 Pieces US$0.26

      1,000-4,999 Pieces US$0.23

      5,000-9,999 Pieces US$0.19

      10,000+ Pieces US$0.16

      Sepcifications

      • Type Combining Rigid Circuit Board
      • Dielectric FR-4
      • Material Fiberglass Epoxy
      • Application Medical Instruments
      • Flame Retardant Properties V0
      • Mechanical Rigid Rigid
      • Processing Technology Delay Pressure Foil
      • Base Material Fr4
      • Insulation Materials Epoxy Resin
      • Transport Package Vacuum+Carton Packing
      • Specification RoHS, ISO9001, UL, SGS
      • Trademark FL
      • Origin Shenzhen, China
      • Board Thickness 1.6mm
      • Board Layer 4 Layers
      • Copper Thickness 1 Oz
      • Solder Mask Green+Yellow
      • Silksreen White+Black
      • Surface Finihsing HASL
      • Lead Time 6-8 Working Days
      • Shipping Type DHL.TNT, EMS, FedEx, UPS etc
      • PCB Design Custom Design Product
      • Board Material Fr4

      Product Description

      BGA Multilayer PCB Circuit Board with high precision, long-term support service Fastline Circuits is capable of providing full turnkey and partial turnkey printed circuit board assembly services. For full turnkey, we take care of the entire process, including preparatio n of Printed Circuit ...

      Learn More

      BGA PCB Comparison
      Transaction Info
      Price US$0.16-0.26 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece
      Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
      Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T, Western Union T/T, Western Union T/T, Western Union T/T, Western Union
      Quality Control
      Management System Certification - ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others
      Trade Capacity
      Export Markets North America, South America, Europe, Southeast Asia/ Mideast Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic
      Annual Export Revenue - - - - -
      Business Model - Own Brand, ODM Own Brand, ODM Own Brand, ODM Own Brand, ODM
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Type: Combining Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Medical Instruments;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Fr4;
      Insulation Materials: Epoxy Resin;
      Board Thickness: 1.6mm;
      Board Layer: 4 Layers;
      Copper Thickness: 1 Oz;
      Solder Mask: Green+Yellow;
      Silksreen: White+Black;
      Surface Finihsing: HASL;
      Lead Time: 6-8 Working Days;
      Shipping Type: DHL.TNT, EMS, FedEx, UPS etc;
      PCB Design: Custom Design Product;
      Board Material: Fr4;
      Type: Combining Rigid Circuit Board;
      Dielectric: MCPCB\Fr4\Bt;
      Application: New Energy Vehicle Electronic Control Board;
      Flame Retardant Properties: Customized;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Double-Sided/Multilayer Aluminum/Copper;
      Insulation Materials: Customized;
      Brand: Hongyu;
      Board Thickness: 1.6mm;
      Metal Core PCB: T2 High Conductivity Copper(1.6mm);
      Thermal Conductivity: 398W/M-K+Non Thermoelectric Separation Ar;
      Copper Foil: 70μm;
      Tg: 150°C;
      Type: Combining Rigid Circuit Board;
      Dielectric: MCPCB\Fr4\Bt;
      Application: New Energy Vehicle Electronic Control Board;
      Flame Retardant Properties: Customized;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Double-Sided/Multilayer Aluminum/Copper;
      Insulation Materials: Customized;
      Brand: Hongyu;
      Board Thickness: 1.6mm;
      Metal Core PCB: T2 High Conductivity Copper(1.6mm);
      Thermal Conductivity: 398W/M-K+Non Thermoelectric Separation Ar;
      Copper Foil: 70μm;
      Tg: 150°C;
      Type: Combining Rigid Circuit Board;
      Dielectric: MCPCB\Fr4\Bt;
      Application: New Energy Vehicle Electronic Control Board;
      Flame Retardant Properties: Customized;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Double-Sided/Multilayer Aluminum/Copper;
      Insulation Materials: Customized;
      Brand: Hongyu;
      Board Thickness: 1.6mm;
      Metal Core PCB: T2 High Conductivity Copper(1.6mm);
      Thermal Conductivity: 398W/M-K+Non Thermoelectric Separation Ar;
      Copper Foil: 70μm;
      Tg: 150°C;
      Type: Combining Rigid Circuit Board;
      Dielectric: MCPCB\Fr4\Bt;
      Application: New Energy Vehicle Electronic Control Board;
      Flame Retardant Properties: Customized;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Double-Sided/Multilayer Aluminum/Copper;
      Insulation Materials: Customized;
      Brand: Hongyu;
      Board Thickness: 1.6mm;
      Metal Core PCB: T2 High Conductivity Copper(1.6mm);
      Thermal Conductivity: 398W/M-K+Non Thermoelectric Separation Ar;
      Copper Foil: 70μm;
      Tg: 150°C;
      Supplier Name

      Fastline Circuits Co., Limited

      Diamond Member Audited Supplier

      Jiangxi Hongyu Circuit Technology Co., Ltd.

      Diamond Member Audited Supplier

      Jiangxi Hongyu Circuit Technology Co., Ltd.

      Diamond Member Audited Supplier

      Jiangxi Hongyu Circuit Technology Co., Ltd.

      Diamond Member Audited Supplier

      Jiangxi Hongyu Circuit Technology Co., Ltd.

      Diamond Member Audited Supplier