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      Rigid-Flex PCB Circuit Board
      US$0.36-0.78 / Piece
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      What is High Technology Rigid-Flex PCB Circuit Board with Fast Prototype

      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      1-999 Pieces US$0.78

      1,000-4,999 Pieces US$0.56

      5,000-9,999 Pieces US$0.46

      10,000+ Pieces US$0.36

      Sepcifications

      • Dielectric Fr4 and Polyimide
      • Transport Package Vacuum+Carton Packing
      • Specification RoHS, ISO9001, UL, SGS
      • Trademark FL
      • Origin Shenzhen, China
      • Board Material Fr4 and Polyimide
      • Board Layer 2 Layer Rigide and 2 Layer Flex
      • Copper Thickness 1 Oz
      • Min. Line Space 0.05mm (2mil)
      • Min Conductor Width 0.05mm(2mil)
      • Min.Hole Size 0.075mm (3mil)
      • Solder Mask Any Color
      • Silkscreen Any Color
      • Surface Finishing Enig, Immersion Tin, Immersion Gold. OSP
      • Lead Time 5-6 Working Days
      • PCB Design Customer Provided
      • Board Thickness 0.1mm
      • Min Pad +/-0.1mm (4mil)
      • Outline Machining Accuracy +/-0.1mm (4mil)
      • MOQ 1 PCS

      Product Description

      High Technology Rigid-Flex PCB Circuit Board with Fast Prototype Fastline could produce 1-26 layers PCB board for electronic products, providing PCB design, PCB fabrication, PCB clone, and PCB assembly services. and we have got the UL, ISO, SGS certifications. Please see our PCB catalog ...

      Learn More

      Rigid-Flex PCB Circuit Board Comparison
      Transaction Info
      Price US$0.36-0.78 / Piece US$20.00 / Piece US$20.00 / Piece US$2.88-5.88 / Piece US$0.20-0.90 / Piece
      Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
      Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, PayPal LC, T/T, PayPal LC, T/T, PayPal LC, T/T, D/P, PayPal, Western Union, Small-amount payment
      Quality Control
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea) North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea) North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea) North America, South America, Europe, Southeast Asia/ Mideast, Africa
      Annual Export Revenue - - - - -
      Business Model - ODM, OEM ODM, OEM ODM, OEM Own Brand
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays, one month, 1-3 months
      Off Season Lead Time: within 15 workdays, one month, 1-3 months
      Peak Season Lead Time: within 15 workdays, one month, 1-3 months
      Off Season Lead Time: within 15 workdays, one month, 1-3 months
      Peak Season Lead Time: within 15 workdays, one month, 1-3 months
      Off Season Lead Time: within 15 workdays, one month, 1-3 months
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Dielectric: Fr4 and Polyimide;
      Board Material: Fr4 and Polyimide;
      Board Layer: 2 Layer Rigide and 2 Layer Flex;
      Copper Thickness: 1 Oz;
      Min. Line Space: 0.05mm (2mil);
      Min Conductor Width: 0.05mm(2mil);
      Min.Hole Size: 0.075mm (3mil);
      Solder Mask: Any Color;
      Silkscreen: Any Color;
      Surface Finishing: Enig, Immersion Tin, Immersion Gold. OSP;
      Lead Time: 5-6 Working Days;
      PCB Design: Customer Provided;
      Board Thickness: 0.1mm;
      Min Pad: +/-0.1mm (4mil);
      Outline Machining Accuracy: +/-0.1mm (4mil);
      MOQ: 1 PCS;
      Dielectric: Aln , Ausn, Ni, Cu;
      Material: Alumina Nitride;
      Metal Material: Au, Sn, Ni, Cu and So on;
      Package: Plastic Box;
      Thermal Conductivity: High;
      Encapsulation: CPU/GPU;
      Dielectric: Aln , Ausn, Ni, Cu;
      Material: Alumina Nitride;
      Metal Material: Au, Sn, Ni, Cu and So on;
      Package: Plastic Box;
      Thermal Conductivity: High;
      Encapsulation: CPU/GPU;
      Dielectric: Aln, Ausn, Ni, Cu;
      Material: Alumina Nitride;
      Metal Material: Au, Sn, Ni, Cu and So on;
      Package: Plastic Box;
      Thermal Conductivity: High;
      Encapsulation: CPU/GPU;
      Dielectric: Design;
      Supplier Name

      Fastline Circuits Co., Limited

      Diamond Member Audited Supplier

      Adena Ceramics International LLC (Shanghai)

      Gold Member Audited Supplier

      Adena Ceramics International LLC (Shanghai)

      Gold Member Audited Supplier

      Adena Ceramics International LLC (Shanghai)

      Gold Member Audited Supplier

      Shenzhen Wonderful Tech Co., Ltd.

      Diamond Member Audited Supplier