High-Density PCBA

US$0.05-0.23 / Piece

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What is High-Density PCBA with Fine Pitch Components 0.3mm Qfp & 0.25mm BGA Automated Optical Inspection for 100% Quality

Name: High-Density PCBA with Fine Pitch Components 0.3mm Qfp & 0.25mm BGA Automated Optical Inspection for 100% Quality
Uploaded: 2026-03-22T09:25:00+08:00
Description: Multilayer PCBA Manufacturer with ISO UL Certification for Single Double PCB Assembly, OEM ODM Services for Consumer Electronics, Automotive, and Medical Applic -- Shenzhen Fastline Circuits Co.,Ltd.

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About this Item

Price

Purchase Qty. Reference FOB Price

1-499 Pieces US$0.23

500-999 Pieces US$0.13

1,000-4,999 Pieces US$0.10

5,000+ Pieces US$0.05

Sepcifications

Type Combining Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Aerospace
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Delay Pressure Foil
Base Material Aluminum
Insulation Materials Organic Resin
Brand Customized
Transport Package Vacuum+Carton Packing
Specification RoHS, ISO9001, UL, SGS
Trademark Fastline
Origin Shenzhen, China
PCB Layer 1-26 Layers
Solder Mask Green
Silk Screen White
Surface Treatment HASL
PCB Assembly Type SMT and DIP
PCB Service One Stop Service
Small Orders Accepted
Copper Thickness 1oz
Board Thickness 1.6mm
Lead Time 12-20 Days

Product Description

Multilayer PCBA Manufacturer with ISO UL Certification for Single Double PCB Assembly, OEM ODM Services for Consumer Electronics, Automotive, and Medical Applic -- Shenzhen Fastline Circuits Co.,Ltd. -- Fastline is a Leading PCB manufacturer in China with a facility area of more than 40,000 ...

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Fastline Circuits Co., Limited

Diamond Member Since 2013

Audited Supplier

Main Products Print Circuit Board, Aluminum PCB, Flexible PCB, Rigid PCB, PCB Prototype, PCB Assembly, ...
Year of Establishment 2006-09-21
Address 3/F, Building B3, Fuqiao No. 4, Fuhai Subdistrict, Baoan District, Shenzhen, Guangdong, China
Plant Area 580 square meters
Registered Capital 1,000,000 RMB
Main Markets North America, South America, Europe, Southeast Asia/ Mideast

High-Density PCBA Comparison

	High-Density PCBA with Fine Pitch Components 0.3mm Qfp & 0.25mm BGA Automated Optical Inspection for 100% Quality Contact Now	Heavy Copper Circuit Board PCB for Quick Turn Industrial Lighting Solutions Contact Now	High Conductivity Copper PCB for Quick Turn Stadium Lights Prototypes Contact Now	UL Certified Thermal Management Board PCB for LED Lighting Applications Contact Now	Custom Heavy Copper PCB Circuit Board for Efficient LED Lighting Solutions Contact Now

Transaction Info
	High-Density PCBA with Fine Pitch Components 0.3mm Qfp & 0.25mm BGA Automated Optical Inspection for 100% Quality Contact Now	Heavy Copper Circuit Board PCB for Quick Turn Industrial Lighting Solutions Contact Now	High Conductivity Copper PCB for Quick Turn Stadium Lights Prototypes Contact Now	UL Certified Thermal Management Board PCB for LED Lighting Applications Contact Now	Custom Heavy Copper PCB Circuit Board for Efficient LED Lighting Solutions Contact Now
Price	US$0.05-0.23 / Piece	US$0.80-2.60 / Piece	US$0.80-2.60 / Piece	US$0.80-2.60 / Piece	US$0.80-2.60 / Piece
Min Order	1 Piece	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	T/T, Western Union	T/T, Western Union	T/T, Western Union	T/T, Western Union
Quality Control
Management System Certification	-	ISO14001, ISO9001:2015, ISO45001:2018, Others	ISO14001, ISO9001:2015, ISO45001:2018, Others	ISO14001, ISO9001:2015, ISO45001:2018, Others	ISO14001, ISO9001:2015, ISO45001:2018, Others
Trade Capacity
Export Markets	North America, South America, Europe, Southeast Asia/ Mideast	Southeast Asia/ Mideast, Domestic	Southeast Asia/ Mideast, Domestic	Southeast Asia/ Mideast, Domestic	Southeast Asia/ Mideast, Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	-	Own Brand, ODM	Own Brand, ODM	Own Brand, ODM	Own Brand, ODM
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Delay Pressure Foil; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: Customized; PCB Layer: 1-26 Layers; Solder Mask: Green; Silk Screen: White; Surface Treatment: HASL; PCB Assembly Type: SMT and DIP; PCB Service: One Stop Service; Small Orders: Accepted; Copper Thickness: 1oz; Board Thickness: 1.6mm; Lead Time: 12-20 Days;	Type: Combining Rigid Circuit Board; Dielectric: MCPCB\Fr4\Bt; Application: New Energy Vehicle Electronic Control Board; Flame Retardant Properties: Customized; Mechanical Rigid: Rigid; Processing Technology: Delay Pressure Foil; Base Material: Double-Sided/Multilayer Aluminum/Copper; Insulation Materials: Customized; Brand: Hongyu; Board Thickness: 1.6mm; Metal Core PCB: T2 High Conductivity Copper(1.6mm); Thermal Conductivity: 398W/M-K+Non Thermoelectric Separation Ar; Copper Foil: 70μm; Tg: 150°C;	Type: Combining Rigid Circuit Board; Dielectric: MCPCB\Fr4\Bt; Application: New Energy Vehicle Electronic Control Board; Flame Retardant Properties: Customized; Mechanical Rigid: Rigid; Processing Technology: Delay Pressure Foil; Base Material: Double-Sided/Multilayer Aluminum/Copper; Insulation Materials: Customized; Brand: Hongyu; Board Thickness: 1.6mm; Metal Core PCB: T2 High Conductivity Copper(1.6mm); Thermal Conductivity: 398W/M-K+Non Thermoelectric Separation Ar; Copper Foil: 70μm; Tg: 150°C;	Type: Combining Rigid Circuit Board; Dielectric: MCPCB\Fr4\Bt; Application: New Energy Vehicle Electronic Control Board; Flame Retardant Properties: Customized; Mechanical Rigid: Rigid; Processing Technology: Delay Pressure Foil; Base Material: Double-Sided/Multilayer Aluminum/Copper; Insulation Materials: Customized; Brand: Hongyu; Board Thickness: 1.6mm; Metal Core PCB: T2 High Conductivity Copper(1.6mm); Thermal Conductivity: 398W/M-K+Non Thermoelectric Separation Ar; Copper Foil: 70μm; Tg: 150°C;	Type: Combining Rigid Circuit Board; Dielectric: MCPCB\Fr4\Bt; Application: New Energy Vehicle Electronic Control Board; Flame Retardant Properties: Customized; Mechanical Rigid: Rigid; Processing Technology: Delay Pressure Foil; Base Material: Double-Sided/Multilayer Aluminum/Copper; Insulation Materials: Customized; Brand: Hongyu; Board Thickness: 1.6mm; Metal Core PCB: T2 High Conductivity Copper(1.6mm); Thermal Conductivity: 398W/M-K+Non Thermoelectric Separation Ar; Copper Foil: 70μm; Tg: 150°C;
Supplier Name	Fastline Circuits Co., Limited	Jiangxi Hongyu Circuit Technology Co., Ltd.	Jiangxi Hongyu Circuit Technology Co., Ltd.	Jiangxi Hongyu Circuit Technology Co., Ltd.	Jiangxi Hongyu Circuit Technology Co., Ltd.
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