| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Exceeding Electronics;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Fastline;
Copper Thickness: 1oz;
Board Thickness: 1.6mm;
Lead Time: 5-7 Days;
Packing Type: Carton + Vacuum;
Shipping Type: DHL, UPS, TNT, EMS, FedEx etc;
Board Layer: 1 to 20 Layers;
Silk Screen Color: White;
Solder Mask: Green, Red, Blue, Black;
Surface Treatment: HASL Lead Free;
Material Type: Fr4;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Brand: Fastline;
Board Thickness: 1.6mm;
Material Type: Fr4;
Copper Thickness: 1oz;
Board Material: Fr-4: Bt HDI;
Surface Treatment: HASL Lead Free;
Solder Mask: Green, Red, Blue, Black;
Silk Screen Color: White;
Board Layer: 1 Layer;
Shipping Type: DHL, UPS, TNT, EMS, FedEx etc;
Packing Type: Carton + Vacuum;
Thickness of Coverlay: 25 Mil;
Number of Silkscreen: 2;
Inner Iayer Cu Thicknes: 35 Mil;
Color of Silkscreen: White;
Peeling Test of Coverlay: No Peelable;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fr4, Fiberglass Epoxy;
Application: Medical Instruments, Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin, Epoxy Resin;
Board Thickness: 1.6mm;
Copper Thicknes: 1oz;
Solder Mask: Green;
Silk Screen: White;
PCB Type: PCB Board Assembly;
Test: 100% Test;
Small Order: Accepted;
Lead Time: 10-15 Days;
Service: High Quality;
Layers: Customzied;
Min Pad: +/- 0.1mm (4mil);
Min Board Thickness: 0.1mm Only for Single and Double Sided;
Min. Line Width/Space: 0.05mm (2mil);
Outline Machining Accuracy: +/- 0.1mm (4mil);
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fr4, Fiberglass Epoxy;
Application: Medical Instruments, Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin, Epoxy Resin;
Board Thickness: 1.6mm;
Copper Thicknes: 1oz;
Solder Mask: Green;
Silk Screen: White;
PCB Type: PCB Board Assembly;
Test: 100% Test;
Small Order: Accepted;
Lead Time: 10-15 Days;
Service: High Quality;
Layers: Customzied;
Min Pad: +/- 0.1mm (4mil);
Min Board Thickness: 0.1mm Only for Single and Double Sided;
Min. Line Width/Space: 0.05mm (2mil);
Outline Machining Accuracy: +/- 0.1mm (4mil);
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