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      PCB Assembly
      US$1.00-30.00 / Piece
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      What is Customized Combined PCBA with DIP/SMD Modules

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      1 Piece US$1.00-30.00 / Piece

      Sepcifications

      • Metal Coating Tin
      • Mode of Production SMT+DIP
      • Layers Multilayer
      • Base Material FR-4
      • Certification RoHS, ISO
      • Customized Customized
      • Condition New
      • Transport Package ESD Bag+Bubble Wrapped +Carton
      • Specification Customized PCBA
      • Trademark EEG
      • Origin Made in China
      • Certificate ISO9001, ISO14001, IATF 16949, Ipc-a-610g, RoHS
      • PCB Material Fr-4, Cem-1, Cem-3, Hight Tg, Fr4 Halogen Free
      • PCB Shape Rectangular, Round, Slots, Cutouts, Complex
      • Solder Mask Green/Black/White/Red/Blue/Yellow/Purple.etc
      • Board Thickness 0.2mm-8mm
      • Copper Thickness 18um-3500um(0.5- 100oz)
      • Service PCB/Componentssourcing/Assembly/Test/Package
      • PCBA QA X-ray, Aoi Test, in-Circuit Test (Ict)
      • Layer 1-36 Layers
      • Max. PCB Size 1900mm*600mm
      • Profiling Punching Routing, V-Cut, Beveling
      • Surface Finishing HASL/HASL Lead Free, Chemical Tin, Chemical Gold
      • PCB Type Rigid PCB, HDI PCB, Flexible PCB, Rigid-Flexible
      • Test X-ray, Aoi, in-Circuit Test (Ict), Functional Test
      • PCBA Packaging ESD Packaging, Shockproof Packaging, Anti-Drop

      Product Description

      Founded in 2001,Exceeding Electronics Group Ltd,provides world-class customer support services. We are an industry lead in automotive, telecommunications, computer, industrial control, medical and power and energy PCB. Buyers from international markets choose to source from us because of our ...

      Learn More

      PCB Assembly Comparison
      Transaction Info
      Price US$1.00-30.00 / Piece US$0.20-10.00 / Piece US$0.98-5.00 / Piece US$2.58-8.00 / Piece US$0.76-5.00 / Piece
      Min Order 1 Piece 10 Pieces 10 Pieces 10 Pieces 10 Pieces
      Payment Terms T/T, PayPal, Western Union, Small-amount payment, VTB T/T T/T T/T T/T
      Quality Control
      Product Certification ISO9001, ISO14001, IATF 16949, Ipc-a-610g, RoHS RoHS, CCC, ISO RoHS, ISO RoHS, CCC, ISO RoHS, ISO
      Management System Certification - ISO9001:2015 ISO9001:2015 ISO9001:2015 ISO9001:2015
      Trade Capacity
      Export Markets North America, South America, Western Europe Domestic Domestic Domestic Domestic
      Annual Export Revenue - - - - -
      Business Model - ODM, OEM ODM, OEM ODM, OEM ODM, OEM
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Product Attributes
      Specification
      Metal Coating: Tin;
      Mode of Production: SMT+DIP;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      PCB Material: Fr-4, Cem-1, Cem-3, Hight Tg, Fr4 Halogen Free;
      PCB Shape: Rectangular, Round, Slots, Cutouts, Complex;
      Solder Mask: Green/Black/White/Red/Blue/Yellow/Purple.etc;
      Board Thickness: 0.2mm-8mm;
      Copper Thickness: 18um-3500um(0.5- 100oz);
      Service: PCB/Componentssourcing/Assembly/Test/Package;
      PCBA QA: X-ray, Aoi Test, in-Circuit Test (Ict);
      Layer: 1-36 Layers;
      Max. PCB Size: 1900mm*600mm;
      Profiling Punching: Routing, V-Cut, Beveling;
      Surface Finishing: HASL/HASL Lead Free, Chemical Tin, Chemical Gold;
      PCB Type: Rigid PCB, HDI PCB, Flexible PCB, Rigid-Flexible;
      Test: X-ray, Aoi, in-Circuit Test (Ict), Functional Test;
      PCBA Packaging: ESD Packaging, Shockproof Packaging, Anti-Drop;
      Metal Coating: Copper;
      Mode of Production: SMT;
      Layers: Multilayer;
      Base Material: FR-6;
      Customized: Customized;
      Condition: New;
      PCBA-Testing: X-ray, Aoi;
      Processing: Electrolytic Foil;
      SMT Capacity: >2 Million Points/Day;
      DIP Capacity: >100K Parts/Day;
      Min. Space of BGA: +/- 0.3mm;
      Min.Pin Space of IC: 0.3mm;
      Max.Precision of IC Assembly: 0.03mm;
      Surface Finishing: Lead-Free HASL;
      Number of Layers: 4-10 Layer;
      Board Thickness: 1.6mm;
      Metal Coating: Copper;
      Mode of Production: SMT;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      PCBA-Testing: X-ray, Aoi;
      Processing: Electrolytic Foil;
      SMT Capacity: >2 Million Points/Day;
      DIP Capacity: >100K Parts/Day;
      Min. Space of BGA: +/- 0.3mm;
      Min.Pin Space of IC: 0.3mm;
      Max.Precision of IC Assembly: 0.03mm;
      Surface Finishing: Lead-Free HASL;
      Number of Layers: 4-10 Layer;
      Board Thickness: 1.6mm;
      Metal Coating: Tin;
      Mode of Production: DIP;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      PCBA-Testing: X-ray, Aoi;
      Processing: Electrolytic Foil;
      SMT Capacity: >2 Million Points/Day;
      DIP Capacity: >100K Parts/Day;
      Min. Space of BGA: +/- 0.3mm;
      Min.Pin Space of IC: 0.3mm;
      Max.Precision of IC Assembly: 0.03mm;
      Surface Finishing: Lead-Free HASL;
      Number of Layers: 4-10 Layer;
      Board Thickness: 1.6mm;
      Metal Coating: Copper;
      Mode of Production: DIP;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      PCBA-Testing: X-ray, Aoi;
      Processing: Electrolytic Foil;
      SMT Capacity: >2 Million Points/Day;
      DIP Capacity: >100K Parts/Day;
      Min. Space of BGA: +/- 0.3mm;
      Min.Pin Space of IC: 0.3mm;
      Max.Precision of IC Assembly: 0.03mm;
      Surface Finishing: Lead-Free HASL;
      Number of Layers: 4-10 Layer;
      Board Thickness: 1.6mm;
      Supplier Name

      EXCEEDING ELECTRONICS GROUP LIMITED

      Diamond Member Audited Supplier

      Shenzhen Hongzhou Smart Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Hongzhou Smart Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Hongzhou Smart Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Hongzhou Smart Technology Co., Ltd.

      Diamond Member Audited Supplier