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      PCB
      US$1.00-2.00 / Piece
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      What is Multilayer PCB for Industrial Applications - Trusted Source

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      1 Piece US$1.00-2.00 / Piece

      Sepcifications

      • Type Rigid Circuit Board
      • Dielectric FR-4
      • Material Fiberglass Epoxy
      • Application Consumer Electronics
      • Flame Retardant Properties V0
      • Mechanical Rigid Rigid
      • Processing Technology Gold Plating Process
      • Base Material Copper
      • Insulation Materials Epoxy Resin
      • Brand Cry
      • Transport Package Vacuum Packing
      • Specification ODM/OEM
      • Trademark CRY
      • Origin China

      Product Description

      Model Number PCB-1.1 Type home appliance pcba Place of Origin Guangdong, China Brand Name CRY Copper Thickness 1 oz Supplier Type customized Product name Professional air conditioner inverter pcb board Application Electronics Device Type Electronic Board Certificate ROSH. ISO9001. ...

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      PCB Comparison
      Transaction Info
      Price US$1.00-2.00 / Piece US$0.98-5.00 / Piece US$0.15-10.00 / Piece US$0.87-5.00 / Piece US$0.15-4.80 / Piece
      Min Order 1 Piece 10 Pieces 10 Pieces 10 Pieces 10 Pieces
      Payment Terms LC, T/T, D/P, Western Union, PayPal, Small-amount payment T/T T/T T/T T/T
      Quality Control
      Product Certification - RoHS, CCC, ISO RoHS, CCC, ISO RoHS, CCC, ISO RoHS, CCC, ISO
      Management System Certification - ISO9001:2015 ISO9001:2015 ISO9001:2015 ISO9001:2015
      Trade Capacity
      Export Markets Southeast Asia/ Mideast Domestic Domestic Domestic Domestic
      Annual Export Revenue - - - - -
      Business Model Own Brand ODM, OEM ODM, OEM ODM, OEM ODM, OEM
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Product Attributes
      Specification
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Gold Plating Process;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: Cry;
      Type: Flexible Circuit Board;
      Dielectric: FR-4;
      Material: Aluminum Covered Copper Foil Layer;
      Application: Communication;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Fexible;
      Processing Technology: Customized;
      Base Material: Aluminum;
      Insulation Materials: Epoxy Resin;
      Brand: OEM/ODM;
      PCBA-Testing: X-ray, Aoi;
      Processing: Electrolytic Foil;
      SMT Capacity: >2 Million Points/Day;
      DIP Capacity: >100K Parts/Day;
      Min. Space of BGA: +/- 0.3mm;
      Min.Pin Space of IC: 0.3mm;
      Max.Precision of IC Assembly: 0.03mm;
      Surface Finishing: Lead-Free HASL;
      Number of Layers: 4-10 Layer;
      Board Thickness: 1.6mm;
      Type: Flexible Circuit Board;
      Dielectric: FR-4;
      Material: Aluminum Covered Copper Foil Layer;
      Application: Communication;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Fexible;
      Processing Technology: Customized;
      Base Material: Aluminum;
      Insulation Materials: Epoxy Resin;
      Brand: OEM/ODM;
      PCBA-Testing: X-ray, Aoi;
      Processing: Electrolytic Foil;
      SMT Capacity: >2 Million Points/Day;
      DIP Capacity: >100K Parts/Day;
      Min. Space of BGA: +/- 0.3mm;
      Min.Pin Space of IC: 0.3mm;
      Max.Precision of IC Assembly: 0.03mm;
      Surface Finishing: Lead-Free HASL;
      Number of Layers: 4-10 Layer;
      Board Thickness: 1.6mm;
      Type: Customized;
      Dielectric: FR-4;
      Material: Aluminum Covered Copper Foil Layer;
      Application: Communication;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Customized;
      Processing Technology: Customized;
      Base Material: Aluminum;
      Insulation Materials: Epoxy Resin;
      Brand: OEM/ODM;
      PCBA-Testing: X-ray, Aoi;
      Processing: Electrolytic Foil;
      SMT Capacity: >2 Million Points/Day;
      DIP Capacity: >100K Parts/Day;
      Min. Space of BGA: +/- 0.3mm;
      Min.Pin Space of IC: 0.3mm;
      Max.Precision of IC Assembly: 0.03mm;
      Surface Finishing: Lead-Free HASL;
      Number of Layers: 4-10 Layer;
      Board Thickness: 1.6mm;
      Type: Customized;
      Dielectric: FR-4;
      Material: Aluminum Covered Copper Foil Layer;
      Application: Communication;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Customized;
      Processing Technology: Customized;
      Base Material: Aluminum;
      Insulation Materials: Epoxy Resin;
      Brand: OEM/ODM;
      PCBA-Testing: X-ray, Aoi;
      Processing: Electrolytic Foil;
      SMT Capacity: >2 Million Points/Day;
      DIP Capacity: >100K Parts/Day;
      Min. Space of BGA: +/- 0.3mm;
      Min.Pin Space of IC: 0.3mm;
      Max.Precision of IC Assembly: 0.03mm;
      Surface Finishing: Lead-Free HASL;
      Number of Layers: 4-10 Layer;
      Board Thickness: 1.6mm;
      Supplier Name

      Shenzhen Chengruyuan Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Hongzhou Smart Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Hongzhou Smart Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Hongzhou Smart Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Hongzhou Smart Technology Co., Ltd.

      Diamond Member Audited Supplier