| Specification |
Usage: Electronic Module Accessorries;
Type: N/a;
Support Network: N/a;
Information content: N/a;
Condition: New;
Material: Plastic;
Type: Case;
Hardness: Medium Soft;
Waterproof: Not Waterproof;
Style: Simplicity;
Color: Black;
Function: Shock Absorbent;
Logo Printing: Without Logo Printing;
Size: Compatible for Board;
Compatible Brand: Raspberry Pi;
Description: Protective Case;
Product Name: Raspberry Pi Zero W Case;
Package: Generic Package;
Mounting Type: DIP;
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Usage: Server;
Type: Custom;
Support Network: Custom;
Information content: Data;
Condition: New;
Machine Type: Hot Chamber Die Casting Machine;
Casting Method: Precision Die Casting;
Application: Communication Equipment, Data Center Hardware;
Machining: CNC Precision Machining & Tapping;
Material: Zinc Alloy (Zamak 3 / Zamak 5);
Surface Prep: Nickel Plating, Sand Blasting;
Pressure Chamber: Horizontal;
Tolerance Grade: CT4-CT5;
Surface Quality: Grade 1;
Specification 2: Compliant with Qsfp-Dd Msa Standard;
Form Factor: Osfp (Octal Small Form-Factor Pluggable);
Connector Compatibility: MPO-12 APC Connectors;
Power Consumption: Optimized for < 8W Applications;
Operating Temperature: Commercial Grade: 0°C to +70°C;
Shielding Performance: Superior EMI/Rfi Shielding for High-Speed Signals;
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Usage: Server;
Type: Custom;
Support Network: Custom;
Information content: Data;
Condition: New;
Machine Type: Hot Chamber Die Casting Machine;
Casting Method: Precision Die Casting;
Application: Communication Equipment, Data Center Hardware;
Machining: CNC Precision Machining & Tapping;
Material: Zinc Alloy (Zamak 3 / Zamak 5);
Surface Prep: Nickel Plating, Sand Blasting;
Pressure Chamber: Horizontal;
Tolerance Grade: CT4-CT5;
Surface Quality: Grade 1;
Specification 2: Compliant with Qsfp-Dd Msa Standard;
Form Factor: Osfp (Octal Small Form-Factor Pluggable);
Connector Compatibility: MPO-12 APC Connectors;
Power Consumption: Optimized for < 8W Applications;
Operating Temperature: Commercial Grade: 0°C to +70°C;
Shielding Performance: Superior EMI/Rfi Shielding for High-Speed Signals;
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Usage: Server;
Type: Custom;
Support Network: Custom;
Information content: Data;
Condition: New;
Machine Type: Hot Chamber Die Casting Machine;
Casting Method: Precision Die Casting;
Application: Communication Equipment, Data Center Hardware;
Machining: CNC Precision Machining & Tapping;
Material: Zinc Alloy (Zamak 3 / Zamak 5);
Surface Prep: Nickel Plating, Sand Blasting;
Pressure Chamber: Horizontal;
Tolerance Grade: CT4-CT5;
Surface Quality: Grade 1;
Specification 2: Compliant with Qsfp-Dd Msa Standard;
Form Factor: Osfp (Octal Small Form-Factor Pluggable);
Connector Compatibility: MPO-12 APC Connectors;
Power Consumption: Optimized for < 8W Applications;
Operating Temperature: Commercial Grade: 0°C to +70°C;
Shielding Performance: Superior EMI/Rfi Shielding for High-Speed Signals;
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Usage: FTTH,FTTB,FTTX;
Type: Fiber Optical;
Support Network: Ethernet;
Information content: Data;
Condition: New;
Network: Wireless LAN, Wired LAN;
Working Temperature: -40~+ 85;
Housing: IP40 Protection Grade, DIN Rail Type, Metal Alumin;
Data Rate: 10/100/1000Mbps;
Device Type: Unmanaged;
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