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      Raspberry Pi
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      What is Raspberry Pi Computer Model 3b+ Embedded Board

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      1 Piece Negotiable

      Sepcifications

      • Metal Coating Tin
      • Mode of Production SMT
      • Layers Single-Layer
      • Base Material Unknown
      • Certification RoHS, CCC
      • Customized Non-Customized
      • Condition New
      • Transport Package Paper Box
      • Specification 1 piece/box
      • Trademark CENTURY SOLUTIONS
      • Origin GB
      • Processor Broadcom Bcm2837b0
      • Memory 1GB
      • Environment Operating Temperature 0–50℃
      • Access 40-Pin Gpio Header
      • Wireless/Bluetooth Yes

      Product Description

      Raspberry Pi 3 Model B+ The final revision of a third-generation single-board computer 1.4GHz 64-bit quad-core processor, dual-band wireless LAN, Bluetooth 4.2/BLE, faster Ethernet, and Power-over-Ethernet support (with separate PoE HAT) Overview The Raspberry Pi 3 Model B+ is the latest ...

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      Raspberry Pi Comparison
      Transaction Info
      Price Negotiable US$2.00 / Piece US$2.00 / Piece US$2.00 / Piece US$0.68-10.80 / Piece
      Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
      Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T, PayPal, Western Union, Small-amount payment T/T, PayPal, Western Union, Small-amount payment T/T, PayPal, Western Union, Small-amount payment PayPal, T/T
      Quality Control
      Product Certification RoHS, CCC RoHS, ISO RoHS, ISO RoHS, ISO RoHS, ISO
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, Europe South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe North America, Europe
      Annual Export Revenue - - - - -
      Business Model ODM, OEM - - - ODM, OEM
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Metal Coating: Tin;
      Mode of Production: SMT;
      Layers: Single-Layer;
      Base Material: Unknown;
      Customized: Non-Customized;
      Condition: New;
      Processor: Broadcom Bcm2837b0;
      Memory: 1GB;
      Environment: Operating Temperature 0–50℃;
      Access: 40-Pin Gpio Header;
      Wireless/Bluetooth: Yes;
      Metal Coating: Gold;
      Mode of Production: SMT;
      Layers: Multilayer;
      Base Material: Fr4, FR-4;
      Customized: Customized;
      Condition: New;
      Type: Rigid Circuit Board;
      Dielectric: Fr-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Insulation Materials: Epoxy Resin;
      Processing Technology: Immersion Gold;
      Copper Thickness: 3oz -105oz;
      Surface Finish: Gold Finger;
      Special Technology: Metal Edging;
      Special 1: Blind Hole;
      Special 2: Buried Vias;
      Special 3: Flex-Rigid PCB;
      Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
      Metal Coating: Gold;
      Mode of Production: SMT;
      Layers: Multilayer;
      Base Material: Fr4, FR-4;
      Customized: Customized;
      Condition: New;
      Type: Rigid Circuit Board;
      Dielectric: Fr-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Insulation Materials: Epoxy Resin;
      Processing Technology: Immersion Gold;
      Copper Thickness: 3oz -105oz;
      Surface Finish: Gold Finger;
      Special Technology: Metal Edging;
      Special 1: Blind Hole;
      Special 2: Buried Vias;
      Special 3: Flex-Rigid PCB;
      Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
      Metal Coating: Gold;
      Mode of Production: SMT;
      Layers: Multilayer;
      Base Material: Fr4, FR-4;
      Customized: Customized;
      Condition: New;
      Type: Rigid Circuit Board;
      Dielectric: Fr-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Insulation Materials: Epoxy Resin;
      Processing Technology: Immersion Gold;
      Copper Thickness: 3oz -105oz;
      Surface Finish: Gold Finger;
      Special Technology: Metal Edging;
      Special 1: Blind Hole;
      Special 2: Buried Vias;
      Special 3: Flex-Rigid PCB;
      Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
      Metal Coating: Copper;
      Mode of Production: SMT;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: Used;
      OEM/Odml: OEM/ODM;
      Supplier Name

      CENTURY SOLUTIONS LIMITED

      Gold Member Audited Supplier

      Shenzhen Hemeixin Electronic Co., Limited

      Gold Member Audited Supplier

      Shenzhen Hemeixin Electronic Co., Limited

      Gold Member Audited Supplier

      Shenzhen Hemeixin Electronic Co., Limited

      Gold Member Audited Supplier

      China Dragon Electronic Industrial Co., Limited

      Diamond Member Audited Supplier