| Specification |
Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0;
Application: Consumer Electronics;
Layer: 1-2 Layers;
Common Finish Board Thickness: 0.3-5mm;
Raw Material: Aluminum Base, Copper Base;
Min Line Width/Space: 3mil(0.075mm);
Impedance Control Tolerance: +/-10%;
Solder Mask/Silkscreen: Custom;
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Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Aerospace;
Base Material: Pi+Fr4;
Service: 7*24 Hours Online;
Technology: Lead The Industry;
Processing Technology: Electrolytic Foil;
Delivery: 5days;
Keyword: FPC, Rigid-Flex, PCB Flexible PCB, Motherboard;
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Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Aerospace;
Base Material: Pi+Fr4;
Service: 7*24 Hours Online;
Technology: Lead The Industry;
Processing Technology: Electrolytic Foil;
Delivery: 5days;
Keyword: FPC, Rigid-Flex, PCB Flexible PCB, Motherboard;
|
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Aerospace;
Base Material: Pi+Fr4;
Service: 7*24 Hours Online;
Technology: Lead The Industry;
Processing Technology: Electrolytic Foil;
Delivery: 5days;
Keyword: FPC, Rigid-Flex, PCB Flexible PCB, Motherboard;
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Insulation Materials: Organic Resin;
Flame Retardant Properties: V2;
Application: Medical Instruments;
Board Thickness: 1.6mm Rigid and 0.1mm Flex;
Copper Thickness: 1oz;
Solder Mask: Green and Yellow;
Silk Screen: White;
Material: Fr4 + Polymide;
PCB Type: Rigid-Flexible PCB;
Test: 100% Test;
Small Order: Accepted;
Lead Time: 5-10 Days;
Service: High Quality;
Dielectric: Fr-4;
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