Double Layer PCB, Small Printed Circuit Board, Multilayer PCB Electronic PCBA Assembly PCB Manufacturer pictures & photos

Double Layer PCB, Small Printed Circuit Board, Multilayer PCB Electronic PCBA Assembly PCB Manufacturer

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Price

Min. Order Reference FOB Price

1 Piece US$0.10-4.88 / Piece

Sepcifications

Dielectric FR-4
Transport Package Vocuum Packing
Specification 250*200 mm
Trademark Abis
Origin Shenzhen, China

Product Description

Double Layer PCB, Small Printed Circuit Board, Multilayer PCB Electronic PCBA Assembly PCB Manufacturer Welcome to our website !! Abis Circuits Co.,Ltd is able to offer one stop 1 to 24 Layer PCB fabrication,PCB manufacturing,PCB Assembly,PCBA Test;FPC fabrication, Aluminium base board ...

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Abis Circuits Co., Ltd.

Diamond Member Since 2017

Audited Supplier

Rating & Reviews: 3.0/5.0

(1 Reviews)

Main Products Yes
Address Room 4113-4116, a Building, Hangcheng Intelligence Security Technology Park, Baoan District, Shenzhen, Guangdong, China
Main Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
International Commercial Terms(Incoterms) FOB, EXW, CFR, CIF, DAP, FCA
Terms of Payment LC, T/T, PayPal, Western Union
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

PCB Comparison

	Double Layer PCB, Small Printed Circuit Board, Multilayer PCB Electronic PCBA Assembly PCB Manufacturer Contact Now	Quick View Professional PCB Board Clone Service Contact Now	Quick View High-Frequency Ceramic Heat Sink Spreader with Au Plating and Wire Bonding Contact Now	Quick View Custom Amb Metallized Aln Substrate with Laser-Drilled Via Holes Contact Now	Quick View Reliable Dbc Metallized Aln Heat Sink Electronic Ceramic Heat Sink Contact Now

Transaction Info
	Double Layer PCB, Small Printed Circuit Board, Multilayer PCB Electronic PCBA Assembly PCB Manufacturer Contact Now	Quick View Professional PCB Board Clone Service Contact Now	Quick View High-Frequency Ceramic Heat Sink Spreader with Au Plating and Wire Bonding Contact Now	Quick View Custom Amb Metallized Aln Substrate with Laser-Drilled Via Holes Contact Now	Quick View Reliable Dbc Metallized Aln Heat Sink Electronic Ceramic Heat Sink Contact Now
Price	US$0.10-4.88 / Piece	US$0.20-0.90 / Piece	US$2.88-5.88 / Piece	US$2.88-5.88 / Piece	US$2.88-5.88 / Piece
Min Order	1 Piece	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	LC, T/T, PayPal, Western Union	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, PayPal	LC, T/T, PayPal	LC, T/T, PayPal
Quality Control
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Europe, Southeast Asia/ Mideast, Africa	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea)	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea)	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea)
Annual Export Revenue	-	-	-	-	-
Business Model	-	Own Brand	ODM, OEM	ODM, OEM	ODM, OEM
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays, one month, 1-3 months Off Season Lead Time: within 15 workdays, one month, 1-3 months	Peak Season Lead Time: within 15 workdays, one month, 1-3 months Off Season Lead Time: within 15 workdays, one month, 1-3 months	Peak Season Lead Time: within 15 workdays, one month, 1-3 months Off Season Lead Time: within 15 workdays, one month, 1-3 months
Product Attributes
Specification	Dielectric: FR-4;	Dielectric: Design;	Dielectric: Aln, Ausn, Ni, Cu; Material: Alumina Nitride; Metal Material: Au, Sn, Ni, Cu and So on; Package: Plastic Box; Thermal Conductivity: High; Encapsulation: CPU/GPU;	Dielectric: Aln, Ausn, Ni, Cu; Material: Alumina Nitride; Metal Material: Au, Sn, Ni, Cu and So on; Package: Plastic Box; Thermal Conductivity: High; Encapsulation: CPU/GPU;	Dielectric: Aln, Ausn, Ni, Cu; Material: Alumina Nitride; Metal Material: Au, Sn, Ni, Cu and So on; Package: Plastic Box; Thermal Conductivity: High; Encapsulation: CPU/GPU;
Supplier Name	Abis Circuits Co., Ltd.	Shenzhen Wonderful Tech Co., Ltd.	Adena Ceramics International LLC (Shanghai)	Adena Ceramics International LLC (Shanghai)	Adena Ceramics International LLC (Shanghai)
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