| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Em825;
Application: Automotive Electronics, Security, Digital Products;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Abis Circuits;
Copper Thickness: 4oz;
Min Line Width/Space: 0.45mm;
Surface Finish: Enig;
Solder Mask Color: Green;
Layer: 2;
Board Thickness: 1.6mm;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Conductive Type: Unipolar Integrated Circuit;
Integration: Ulsi;
Technics: Thick Film IC;
Regular Board Thickness: 1.6mm;
Board Material: Fr4, Bt HDI Material;
Board Layer: 4 Layers;
Surface Finihsing: HASL-Lf, Enig, Immersion Gold, Immersion Tin, OSP;
Copper Thickness: 1 Oz;
Thickness of Copper Foil Wire: 8-240 Um(4oz);
Min. Hole Size: 0.075mm(3mil);
Min Pad: +/- 0.1mm (4mil);
Min Board Thickness: 0.1mm Only for Single and Double Sided;
Min. Line Width/Space: 0.05mm (2mil);
Outline Machining Accuracy: +/- 0.1mm (4mil);
Lead Time: 6-8 Working Days;
Silksreen: Any You Like;
Solder Mask: Any You Like;
MOQ: 1PCS;
Shape: Round;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Conductive Type: Unipolar Integrated Circuit;
Integration: Ulsi;
Technics: Thick Film IC;
Regular Board Thickness: 1.6mm;
Board Material: Fr4, Bt HDI Material;
Board Layer: 4 Layers;
Surface Finihsing: HASL-Lf, Enig, Immersion Gold, Immersion Tin, OSP;
Copper Thickness: 1 Oz;
Thickness of Copper Foil Wire: 8-240 Um(4oz);
Min. Hole Size: 0.075mm(3mil);
Min Pad: +/- 0.1mm (4mil);
Min Board Thickness: 0.1mm Only for Single and Double Sided;
Min. Line Width/Space: 0.05mm (2mil);
Outline Machining Accuracy: +/- 0.1mm (4mil);
Lead Time: 6-8 Working Days;
Silksreen: Any You Like;
Solder Mask: Any You Like;
MOQ: 1PCS;
Shape: Round;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Fastline;
Copper Thickness: 1oz;
Board Thickness: 1.6mm;
Lead Time: 5-7 Days;
Packing Type: Carton + Vacuum;
Shipping Type: DHL, UPS, TNT, EMS, FedEx etc;
Board Layer: 1 to 20 Layers;
Silk Screen Color: White;
Solder Mask: Green, Red, Blue, Black;
Surface Treatment: HASL Lead Free;
Material Type: Fr4;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Fastline;
Copper Thickness: 1oz;
Board Thickness: 1.6mm;
Lead Time: 5-7 Days;
Packing Type: Carton + Vacuum;
Shipping Type: DHL, UPS, TNT, EMS, FedEx etc;
Board Layer: 1 to 20 Layers;
Silk Screen Color: White;
Solder Mask: Green, Red, Blue, Black;
Surface Treatment: HASL Lead Free;
Material Type: Fr4;
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