OEM/ODMRoHS
Blind & Buried Via HDI PCB Micro Vias Down to 0.1mm High-Density Interconnect for Smartphones & IoT Modules
US$0.23
1-499?Pieces
US$0.13
500-999?Pieces
US$0.10
1,000-4,999?Pieces
US$0.05
5,000+?Pieces
Customization
Available
Metal Coating
Copper
Mode of Production
SMT
Layers
Multilayer
Base Material
FR-4
Availability
In Stock
Shipping Cost:?
Contact the supplier about freight and estimated delivery time.
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