OEM/ODMFiberglass Epoxy Resin + Polyimide Resin
Multilayer PCBA Android Mobile Phone Motherboard From Shenzhen SMT
US$20.00
5-9,999?pcs
US$5.00
10,000+?pcs
Customization
Available
Type
Combining Rigid Circuit Board
Dielectric
FR-4
Material
Fiberglass Epoxy Resin + Polyimide Resin
Application
Consumer Electronics
Flame Retardant Properties
V0
Shipping Cost:?
Contact the supplier about freight and estimated delivery time.
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