0.1-0.5mm Copper Thickness Si3n4 Silicon Nitride Amb Substrate for High Power Device Packaging
US$20.00
1-99?pieces
US$15.00
100+?pieces
Application
Aerospace, Ceramic Decorations, Medical, Amb Substrate
Compressive Strength
2300MPa
Coating Thickness
8-30μm
Coating Layer
Mo/Mn
Plated Layer
Nickel/Copper/Gold
Thermal Conductivity
25W/(M.K)
Shipping Cost:?
Contact the supplier about freight and estimated delivery time.
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